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Author: search.filters.author.Ariga, TadashiSubject: search.filters.subject.Microstructure

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    Influence of thermal aging on microhardness and microstructure of Sn-0.3Ag-0.7Cu-xIn lead-free solders
    (2010-08-31)
    Kanlayasiri, Kannachai
    ;
    Ariga, Tadashi
    Sn-0.3Ag-0.7Cu is a low-silver lead-free solder, and provides a thinner brittle Ag<inf>3</inf>Sn intermetallic layer during soldering process. In this paper, effects of thermal aging on microhardness, and microstructure of Sn-0.3Ag-0.7Cu-xIn lead-free solders were investigated. Indium was added to lower the melting temperature, and varied from 0.0 to 3.0 wt%. The solders were thermally aged at 100 °C for 1, 10, 100, and 1000 h. Results showed that microhardness of the solders decreases as the aging time increases, and average grain size of the microstructure is larger with the increase of the aging time. It was also found that the higher In content in the solder provides the greater decreasing rate of its microhardness. © 2010 Elsevier B.V. All rights reserved.
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    Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloy
    (2009-10-19)
    Kanlayasiri, Kannachai
    ;
    Mongkolwongrojn, Mongkol
    ;
    Ariga, Tadashi
    Effects of indium (In) addition on solidus and liquidus temperatures, wetting time, wetting force, tensile strength, and microhardness of Sn-0.3Ag-0.7Cu lead-free solder alloy were investigated in this paper. Indium was added and varied from 0 to 3 wt%. It is found that solidus and liquidus temperatures of the solder alloy are lowered as the In content is increased. However, In also increases the melting range between solidus and liquidus temperatures. Wetting time of the solder alloy is reduced by the addition of In while the wetting force is increased with the increase of In content. With the addition of In, the Sn-rich phase is smaller in size, and the intermetallic compounds are more uniformly distributed. As a result, tensile strength and microhardness of Sn-0.3Ag-0.7Cu are increased when In is added into the solder alloy. © 2009 Elsevier B.V. All rights reserved.