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A New Technique for Brazing Porous Copper to Copper Substrate Using CuNiSnP Amorphous Filler Metal
(2025-11-01)
Mookam, Niwat
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Jattakul, Prajak
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Ariga, Tadashi
;
Kanlayasiri, Kannachai
Furnace brazing is a common method for bonding porous metal to a substrate. However, it typically involves lengthy brazing times. This research introduces a novel rapid brazing technique to join porous copper to copper substrates. Using CuNiSnP amorphous filler metal, porous copper specimens were brazed under varying currents (250-1000 A) and times (900-1100 ms). Results showed successful joining without macroscopic deformation of the porous copper, and the brazing times were significantly shorter than those of traditional methods. Microstructural analysis revealed primary alpha, primary beta, and eutectic structures in the joint, all of which were influenced by brazing current and time. Adjusting the brazing conditions altered the morphology of the primary alpha structure, ranging from equiaxed to columnar dendrites, which in turn affected the joint's mechanical properties. The proposed technique offers an efficient method to manipulate joint microstructures for bonding porous copper to copper substrates, potentially improving manufacturing efficiency in industries such as heat exchangers or catalytic converters.
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Influence of indium and zinc oxide nano-particles on properties of SAC0307-xIn-yZnO lead-free solder paste
(2016-02-17)
McCsathicn, Nadee
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Makoto, Sawada
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Ariga, Tadashi
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Kanlayasiri, Kannachai
The influence of indium (In) and zinc oxide (ZnO) nano-particles on the properties of SAC0307-xIn-yZnO lead-free solder paste was presented in this paper. Solder paste was mixed with indium and zinc oxide nano-particles at various concentrations. The influence of these particles on melting point. wettability and interfacial layer after soldering with copper substrate was investigated. The results showed that the addition of lower levels of indium and zinc oxide nano-particles could reduce the melting temperature of SAC0307. Wettability of the solders on copper substrate in terms of contact angle was obviously decreased with the increase of appropriate indium and zinc oxide nano-particle concentration. The zinc oxide nano-particles affected the thickness value of the intermetallic layer. giving it a lower and more uniform distribution between the solder and copper substrate.
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Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate
(2015-12-05)
Kanlayasiri, Kannachai
;
Ariga, Tadashi
The aims of this research are to investigate the effects of Ni on the physical properties of Sn58Bi-xNi lead-free solder, and to examine its interfacial reaction with the copper substrate. In the experiments, four concentrations of Ni (i.e. 0.05, 0.1, 0.5 and 1.0wt.%) were individually added into Sn58Bi and their respective microstructure, tensile strength, elongation, melting temperature, wettability and electrical resistivity of Sn58Bi-xNi were subsequently measured. The results indicated that Ni refined the microstructure of the solder matrix and induced the formation of Ni<inf>3</inf>Sn<inf>4</inf> intermetallic phase, and that the size and volume fraction of Ni<inf>3</inf>Sn<inf>4</inf> were positively correlated to the Ni content. The optimal concentration of Ni to enhance the tensile strength of the alloy was 0.1wt.%, but the elongation of the alloy was inversely correlated to the Ni content. The addition of Ni contributed positively to the melting temperature and wetting behavior of the alloy, whereas no significant change in the electrical resistivity of Sn58Bi-xNi was detected. In addition, Ni increased the thickness of the intermetallic layer at the interface, and only monoclinic η'-Cu<inf>6</inf>Sn<inf>5</inf> phase was present at the intermetallic layer. Nevertheless, the intermetallic phase of this research was dissimilar from the findings of existing literature.
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Influence of thermal aging on microhardness and microstructure of Sn-0.3Ag-0.7Cu-xIn lead-free solders
(2010-08-31)
Kanlayasiri, Kannachai
;
Ariga, Tadashi
Sn-0.3Ag-0.7Cu is a low-silver lead-free solder, and provides a thinner brittle Ag<inf>3</inf>Sn intermetallic layer during soldering process. In this paper, effects of thermal aging on microhardness, and microstructure of Sn-0.3Ag-0.7Cu-xIn lead-free solders were investigated. Indium was added to lower the melting temperature, and varied from 0.0 to 3.0 wt%. The solders were thermally aged at 100 °C for 1, 10, 100, and 1000 h. Results showed that microhardness of the solders decreases as the aging time increases, and average grain size of the microstructure is larger with the increase of the aging time. It was also found that the higher In content in the solder provides the greater decreasing rate of its microhardness. © 2010 Elsevier B.V. All rights reserved.
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Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloy
(2009-10-19)
Kanlayasiri, Kannachai
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Mongkolwongrojn, Mongkol
;
Ariga, Tadashi
Effects of indium (In) addition on solidus and liquidus temperatures, wetting time, wetting force, tensile strength, and microhardness of Sn-0.3Ag-0.7Cu lead-free solder alloy were investigated in this paper. Indium was added and varied from 0 to 3 wt%. It is found that solidus and liquidus temperatures of the solder alloy are lowered as the In content is increased. However, In also increases the melting range between solidus and liquidus temperatures. Wetting time of the solder alloy is reduced by the addition of In while the wetting force is increased with the increase of In content. With the addition of In, the Sn-rich phase is smaller in size, and the intermetallic compounds are more uniformly distributed. As a result, tensile strength and microhardness of Sn-0.3Ag-0.7Cu are increased when In is added into the solder alloy. © 2009 Elsevier B.V. All rights reserved.

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