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Author: search.filters.author.Bunjongpru, W.Subject: search.filters.subject.Aluminum nitride (AIN)

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    Item type:Publication,
    Oxygen control on nanocrystal-AION films by reactive gas-timing technique R.F. magnetron sputtering and annealing effect
    (2008-12-01)
    Bunjongpru, W.
    ;
    Pomtheeraphat, S.
    ;
    Somwang, N.
    ;
    Khomdet, P.
    ;
    Hruanun, C.
    The AlON films grown on Si(100) substrates by using radio frequency (r.f.) magnetron sputtering from high purity aluminum (99.999% Al) target with a novel reactive gas-timing technique. The 100 nm thick of AlON films were deposited with 200 watts r.f. power and the substrate temperature is maintained at room temperature by the technique of gas-timing which varying flow-in sequence of high purity of Ar (99.999%) and N<inf>2</inf> (99.9999%) gases fed into the sputtering chamber at 10:90 (sec) ratio. The composition and crystal orientation of AlON films affected by gas-timing of Ar and N<inf>2</inf> were analyzed by Auger Electron Spectroscopy (AES) and Xray diffraction (XRD). The oxygen atoms revealed by AES formed into a corporation in films was studied. This suggests that the oxygen contamination formed as A10<inf>x</inf>N<inf>y</inf> compound may due to the residual oxygen in base pressure of 10<sup>-7</sup> mbar and higher reactivity of oxygen in the reactor compared to nitrogen. The gas-timing technique used in the sputtering growth system shows the advantage of the oxygen quantity control, while the general sputtering process (without gas-timing technique) shows an increase of the oxygen composition depended on film thickness. The characterizations results clearly indicate that the gas-timing r.f. magnetron sputtering technique plays an important role to control the incorporation of oxygen and to form the nanocrystalaluminum oxynitride films which very attractive for various sensors applications. © 2008 Trans Tech Publications, Switzerland.