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Item type:Publication, Investigation of Contact Angles of SnAgCu Solder Paste Mixed with Graphene Oxide Using Digital Holography Technique(2021-01-20) ;Jongjinakool, Kavisra ;Prakobsang, Tawipon ;Plaipichit, Suwan ;Kanlayasiri, KannachaiKitiwan, MettayaSince lead is a pollutant to the environment, therefore lead-free solder paste compounds have been interested in many research teams. The objective of this research is the investigation properties of solder paste with graphene oxide and reduced graphene oxide. In our experimental method the solder pastes of SnAgCu mixed with graphene oxide with bad electrical conductivity at different concentration by weight of 0.00%, 0.05%, 0.1% and 0.2% respectively. Subsequently, the shape changes of the compounds have been investigated by using digital in-line holography using laser diode wavelength 635 nm as the light source. The solder paste compounds were melted at 250 ± 5 °C and were recorded for every 5 seconds. Then, the contact angles of the melted solder paste compound have been determined using their digital holographic reconstructed images. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, The Property Investigation of Solder Mixed with Thermoelectrics Alzno by Using Digital Holography(2018-08-10) ;Prakobsang, Tawipon ;Plaipichit, Suwan ;Kanlayasiri, KannachaiBuranasiri, PrathanIn this paper in-line digital holography(DH) technique was used to investigate some properties of solder paste mixed with different percent weight of thermoelectric type AlZnO. By using reconstructed image results different properties of the compound solder pastes i.e. the contact angles, flux thickness were investigated. In addition, their electrical resistance also measured. From our reconstructed image results DH technique plus some computer programming would be one of efficient technique using in electronic industry in the future. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Quality Investigation of surface mount technology using phase-shifting digital holography(2016-01-01) ;Boonsri, ChantiraBuranasiri, PrathanApplying of a phase-shifting digital holography combined with compressive sensing to inspect the soldering quality of surface mount technology (SMT) which is a method for producing electronic circuits. In SMT, the components are mounted and connected with each other directly onto the surface of printed circuit boards (PCBs). By reconstructing the multidimensional images from a few samples of SMT, the results are solved by an optimization problem. In this paper, two problems have been concerned. The first one is to examine the devices and the soldering quality of connections between them, which are in micro-scaled. The second is to observe the effect of heat treatment of soldering material and devices on the surface mount board.
