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    Formation of HfOxNy nanorod GLAD films growth by rapid thermal oxidation
    (2023-01-01)
    Phae-ngam, W.
    ;
    Prathumsit, J.
    ;
    Chananonnawathorn, C.
    ;
    Nakajima, H.
    ;
    Lertvanithphol, T.
    In this work, the hafnium oxynitride (HfON) nanorod films on p-type silicon (Si) wafer substrate have been fabricated by reactive magnetron sputtering with glancing angle deposition (GLAD) technique, subsequently with a rapid thermal oxidation process at 500–900 °C under low-vacuum state. The crystallinity and morphology were investigated by glazing-incident X-ray diffraction (GIXRD) and field-emission scanning electron microscopy (FE-SEM), respectively. As-deposited films were amorphous nanorod films. The surface-sensitive X-ray photoelectron spectroscopy (XPS) analytical technique revealed that nitrogen atoms are increasingly replaced with oxygen atoms at the surface. The distribution of nitrogen atoms investigated by X-ray absorption spectroscopy (XAS) revealed the substitution of nitrogen with oxygen at the film surface and molecular nitrogen trapped in the film as the annealing temperature was increased.
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    Effect of sputtering power on optical properties of nickel oxide electrochromic thin films
    (2020-01-01)
    Panprom, P.
    ;
    Sritonwong, P.
    ;
    Limwichian, S.
    ;
    Eiamchai, P.
    ;
    Patthanasettakul, V.
    The preparation and characterization of nickel oxide (NiO) thin film for electrochromic smart window applications are studied. The NiO thin film was prepared by the DC magnetron sputtering from a pure nickel target. The sputtering power was varies in the interval 50–200 W. The crystallinity and physical morphology of NiO films are characterized by X-ray diffraction (XRD) and field emission scanning electron microscopy (FE-SEM), respectively. The XRD result revealed that polycrystalline NiO thin films with preferred growth directions along (111) and (200) planes are obtained. Moreover, the electrochromic property of NiO thin films was investigated with a UV-Visible spectrophotometer. The colored state of the electrochromic cell was obtained by the ion insertion at the 1-V external applied bias in 0.1 M KOH. The reversibility between the colored and bleached states is confirmed by the optical transmittance. The result shows the optical contrast as high as 28.68.
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    Item type:Publication,
    Spectroscopic study on amorphous tantalum oxynitride thin films prepared by reactive gas-timing RF magnetron sputtering
    (2019-10-30)
    Lertvanithphol, T.
    ;
    Rakreungdet, W.
    ;
    Chananonnawathorn, C.
    ;
    Eiamchai, P.
    ;
    Limwichean, S.
    The amorphous tantalum oxynitride (TaO<inf>x</inf>N<inf>y</inf>) thin films were prepared on silicon (100) substrates by magnetron sputtering system with different techniques of conventional reactive sputtering and reactive gas-timing (RGT). The films were studied via spectroscopic ellipsometry (SE) measured in the range of 0.75–5.0 eV with 0.025 eV interval at 70° incident angle, and the optical model based on Tauc-Lorentz function was constructed to extract the properties of the films. The SE results indicated that all prepared films were grown homogeneously and show different optical properties upon their deposition conditions and techniques. The optical properties of film prepared by conventional reactive sputtering were close to the tantalum oxide film (TaO). The refractive index and optical band gap (E<inf>g</inf>) of RGT samples changed with the oxygen timing and correlated with the change of oxygen and nitrogen concentration of the films. In addition, the morphologies, crystallinities, atomic concentrations and distributions of nitrogen atoms in the films analyzed by field-emission scanning electron microscopy, glazing-incident X-ray diffraction, X-ray photoelectron spectroscopy and X-ray absorption spectroscopy are also discussed.
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    Observations of the initial stages on reactive gas-timing sputtered TaO thin films by dynamic in situ spectroscopic ellipsometery
    (2019-06-01)
    Chittinan, D.
    ;
    Buranasiri, P.
    ;
    Lertvanithphol, T.
    ;
    Eiamchai, P.
    ;
    Patthanasettakul, V.
    Dynamic in-situ spectroscopic ellipsometry (iSE) was employed to investigate the growth mechanism of the tantalum oxide (TaO) film on silicon wafer substrate deposited by reactive gas-timing RF magnetron sputtering compared with conventional reactive sputtering. The effect of reactive gas timing parameter on physical structure and optical property were analyzed by both the continuous and island film growth model with Tauc-Lorentz optical model. The variation of refractive index, film thickness and void volume fraction were obtained from dynamic fits of iSE data indicated that the growth process of the amorphous TaO thin films was divided into two regimes: the nucleation stage and continuous-layer stage. These stages were observed during deposition although the initial film growth stage corresponds to the island film growth model. The study demonstrates that sputtered TaO by the RGT technique at the O<inf>2</inf> on-off gas timing has played a crucial factor in improving the formation of nucleation stage and that the deposited TaO thin films were high deposition rate with high refractive index. The complementary field emission scanning electron microscope (FE-SEM) and transmission electron microscope (TEM) showed a good agreement with the film thickness and morphology obtained from dynamic iSE measurement. The real-time monitoring of iSE offers important evidences to understand the growth mechanism of reactive gas-timing technique.
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    Omnidirectional anti-reflection properties of vertically align SiO2 nanorod films prepared by electron beam evaporation with glancing angle deposition
    (2018-01-01)
    Prachachet, R.
    ;
    Samransuksamer, B.
    ;
    Horprathum, M.
    ;
    Eiamchai, P.
    ;
    Limwichean, S.
    Omnidirectional anti-reflection coating nanostructure film have attracted enormous attention for the developments of the optical coating, lenses, light emitting diode, display and photovoltaic. However, fabricated of the omnidirectional antireflection nanostructure film on glass substrate in large area was a challenge topic. In the past two decades, the invention of glancing angle deposition technique as a growth of well-controlled two and three-dimensional morphologies has gained significant attention because of it is simple, fast, cost-effective and high mass production capability. In this present work, the omnidirectional anti-reflection nanostructure coating namely silicon dioxide (SiO<inf>2</inf>) nanorods has been investigated for optimized high transparent layer at all light incident angle. The SiO<inf>2</inf> nanorod films of an optimally low refractive index have been fabricated by electron beam evaporation with the glancing angle deposition technique. The morphological of the prepared sampled were characterized by field-emission scanning electron microscope (FE-SEM) and high-resolution transmission electron microscope (HRTEM). The optical transmission and omnidirectional property of the SiO<inf>2</inf> nanorod films were investigated by UV-Vis-NIR spectrophotometer. The measurement were performed at normal incident angle and a full spectral range of 200 - 2000 nm. The angle dependent transmission measure were investigated by rotating the specimen, with incidence angle defined relative to the surface normal of the prepared samples. The morphological characterization results showed that when the glancing angle deposition technique was applied, the vertically align SiO<inf>2</inf> nanorods with partially isolated columnar structure can be constructed due to the enhanced shadowing and limited addtom diffusion effect. The average transmission of the vertically align SiO<inf>2</inf> nanorods were higher than the glass substrate reference sample over the visible wavelength range at all incident angle due to the transition in the refractive index profile from air to the nanostructure layer that improved the anti-reflection characteristics.
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    Item type:Publication,
    A comparative study on omnidirectional anti-reflection SiO2 nanostructure films coating by glancing angle deposition
    (2018-01-01)
    Prachachet, R.
    ;
    Samransuksamer, B.
    ;
    Horprathum, M.
    ;
    Eiamchai, P.
    ;
    Limwichean, S.
    Fabricated omnidirectional anti-reflection nanostructure films as a one of the promising alternative solar cell applications have attracted enormous scientific and industrial research benefits to their broadband, effective over a wide range of incident angles, lithography-free and high-throughput process. Recently, the nanostructure SiO<inf>2</inf> film was the most inclusive study on anti-reflection with omnidirectional and broadband characteristics. In this work, the three-dimensional silicon dioxide (SiO<inf>2</inf>) nanostructured thin film with different morphologies including vertical align, slant, spiral and thin films were fabricated by electron beam evaporation with glancing angle deposition (GLAD) on the glass slide and silicon wafer substrate. The morphological of the prepared samples were characterized by field-emission scanning electron microscope (FE-SEM) and high-resolution transmission electron microscope (HRTEM). The transmission, omnidirectional and birefringence property of the nanostructure SiO<inf>2</inf> films were investigated by UV-Vis-NIR spectrophotometer and variable angle spectroscopic ellipsometer (VASE). The spectrophotometer measurement was performed at normal incident angle and a full spectral range of 200 - 2000 nm. The angle dependent transmission measurements were investigated by rotating the specimen, with incidence angle defined relative to the surface normal of the prepared samples. This study demonstrates that the obtained SiO2 nanostructure film coated on glass slide substrate exhibits a higher transmission was 93% at normal incident angle. In addition, transmission measurement in visible wavelength and wide incident angles -80 to 80 were increased in comparison with the SiO2 thin film and glass slide substrate due to the transition in the refractive index profile from air to the nanostructure layer that improve the antireflection characteristics. The results clearly showed the enhanced omnidirectional and broadband characteristic of the three dimensional SiO2 nanostructure film coating.
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    Item type:Publication,
    Phase formation polycrystalline vanadium oxide via thermal annealing process under controlled nitrogen pressure
    (2017-10-20)
    Jessadaluk, S.
    ;
    Khemasiri, N.
    ;
    Rahong, S.
    ;
    Rangkasikorn, A.
    ;
    Kayunkid, N.
    This article provides an approach to improve and control crystal phases of the sputtering vanadium oxide (V<inf>x</inf>O<inf>y</inf>) thin films by post-thermal annealing process. Usually, as-deposited V<inf>x</inf>O<inf>y</inf> thin films at room temperature are amorphous phase: post-thermal annealing processes (400 °C, 2 hrs) under the various nitrogen (N<inf>2</inf>) pressures are applied to improve and control the crystal phase of V<inf>x</inf>O<inf>y</inf> thin films. The crystallinity of V<inf>x</inf>O<inf>y</inf> thin films changes from amorphous to α-V<inf>2</inf>O<inf>5</inf> phase or V<inf>9</inf>O<inf>17</inf> polycrystalline, which depend on the pressure of N<inf>2</inf> carrier during annealing process. Moreover, the electrical resistivity of the V<inf>x</inf>O<inf>y</inf> thin films decrease from 10<sup>5</sup> Ω cm (amorphous) to 6×10<sup>-1</sup> Ω cm (V<inf>9</inf>O<inf>17</inf>). Base on the results, our study show a simply method to improve and control phase formation of V<inf>x</inf>O<inf>y</inf> thin films<inf>.</inf>
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    Investigation of optical characteristics of the evaporated Ta2O5 thin films based on ellipsometry and spectroscopy
    (2017-01-01)
    Prachachet, R.
    ;
    Buranasiri, P.
    ;
    Horprathum, M.
    ;
    Eiamchai, P.
    ;
    Limwichean, S.
    The tantalum oxide (Ta<inf>2</inf>O<inf>5</inf>) thin films were prepared by the ion-assisted electron-beam evaporation system. With the fixed film thickness at 200 nm, the deposition conditions were performed based on oxygen flow rate the ion assistance during the film deposition. The prepared thin films were characterized by spectroscopic ellipsometry in order to determine their physical and optical properties. From the ellipsometric measurements, the physical structures of the thin films and the optical dispersions were constructed, and then analyzed for the results of film thickness and optical constants. The thin films were also measured by the UV-Vis-NIR spectrophotometry for the optical transmission. The measured transmission was analyzed with the Swanepoel method, whose results also yielded the thickness and the refractive index. Finally, the thin films were examined by the scanning electron microscopy (SEM) in order to observe physical microstructures. This study explored the physical and optical analyses based on the spectroscopic ellipsometry and the spectrophotometry, with the confirmations from the SEM micrographs. The results from the analyses would be compared and thoroughly discussed.
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    Optical band engineering of metal-oxynitride based on tantalum oxide thin film fabricated via reactive gas-timing RF magnetron sputtering
    (2016-11-25)
    Khemasiri, N.
    ;
    Jessadaluk, S.
    ;
    Chananonnawathorn, C.
    ;
    Vuttivong, S.
    ;
    Lertvanithphol, T.
    In this paper, we demonstrate a novel technique, as called reactive gas-timing (RGT) RF magnetron sputtering, to control and design an optical band engineering of TaON thin films without an external heating substrate temperature and post annealing treatment process. The influence of the oxygen intervals ranged from 5 to 60 s on deposition rate, chemical composition and optical properties of TaON thin films were investigated. The chemical composition was characterized by auger electron spectroscopy (AES). The optical properties were determined by UV–Vis spectrophotometer and spectroscopic ellipsometry. The nitrogen atomic concentration of the TaON thin films deposited by RGT decreased when the oxygen gas-timing intervals increased. In addition, the RGT sputtered TaON films could be demonstrated band gaps engineering from 1.90 to 2.15 eV.
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    Silicon nitride thin films deposited by reactive gas-timing magnetron sputtering for protective coating applications
    (2015-01-01)
    Khemasiri, N.
    ;
    Paleeya, N.
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    Sae-tang Phromyothin, D.
    ;
    Horprathum, M.
    ;
    Porntheeraphat, S.
    Silicon nitride is a promising alternative to carbon based materials for protective coatings, owing to its compatibility with existing silicon-based microfabrication. The complexity of the fabrication processes and contaminations hamper fine-tuning to obtain desirable coating properties. We have explored the reactive gas-timing rf plasma sputtering technique for silicon nitride thin film deposition as an alternative method to fine-tune the film properties. The gas-timing technique controls the on-off sequence of the sputtering gas (Ar) and the reactive gas (N<inf>2</inf>) during deposition. We focus this investigation to the effect of the Ar:N<inf>2</inf> gas timing ratio (10:0, 10:1, 10:3, 10:5, 10:7 and 10:10) on the composition, the morphology, the corrosion resistance, and the hardness properties of the films, in comparison to the films deposited by conventional reactive sputtering with Ar-N<inf>2</inf> gas mixture. These deposited silicon nitride films were characterized by Auger electron spectroscopy, Raman spectroscopy, and atomic force microscopy. The chemical resistance was measured by the electrochemical corrosion test in sulfuric acid, while the hardness properties were obtained by nanoindentation. The results reveal that although the nitrogen content in the films increases only slightly when the N<inf>2</inf> timing is prolonged, the corrosive current of the films decreases abruptly. A thin passivating oxidized layer is found to play a major role in the corrosion resistance. In contrast, the hardness properties exhibit a uniform variation with the N<inf>2</inf> timing. The gas-timing sequence may induce morphological changes the underlying silicon nitride films. The highest hardness obtained by the gas-timing technique almost doubles that produced by the conventional mixed gas sputtering. Thus the reactive gas-timing technique suggests a new route to selectively control the properties of silicon nitride films with minor modification to existing microfabrication processes.