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Author: search.filters.author.Kanlayasiri, KannachaiSubject: search.filters.subject.Interface

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    Brazing of curved copper sheets using CuNiSnP amorphous filler metal
    (2019-09-30)
    Jattakul, Prajak
    ;
    Kanlayasiri, Kannachai
    This research investigates the effect of bending stress using furnace brazing on the interfacial layer between curved copper sheets and CuNiSnP amorphous filler metal. Copper sheet curvatures were varied between 5, 10, 15, 20, and ∞ mm to manipulate the bending stress of the base metal. The thermal behaviors and phase transformations of CuNiSnP amorphous filler metal were also characterized. The results showed that crystallization of the filler metal started at 200 °C, with multiple phases formed over the course of thermal treatment. The curved radius and bending stress were inversely correlated, while the interfacial layer of brazed joints and copper sheet curvatures were positively correlated. The interfacial layer was thin in small curvature specimens and thick in large radius specimens, indicating that the bending stress in the base metal affected the reliability of brazed joints.
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    Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate
    (2016-05-25)
    Kanlayasiri, Kannachai
    ;
    Sukpimai, Kamtorn
    This research has investigated the effects of indium on the intermetallic layer formation attributable to the reaction between low-Ag SAC0307-xIn lead-free solder and a Cu substrate, where x = 0, 0.5, 1.0, 1.5, 2.0, 2.5 and 3.0 wt%. This study has also examined the post-soldering and post-thermal aging interfacial layers. Morphology parameters were utilized to represent the shape of total intermetallic layer at the interface. The findings indicated that indium had no effect on the pre- and post-aging intermetallic layer overall thicknesses but lowered the Cu<inf>3</inf>Sn/Cu<inf>6</inf>Sn<inf>5</inf> thickness ratio; and that the concentrations of indium exhibited no influence over the post-soldering and post-thermal aging morphology parameter values. In the experiments, the morphology parameter value decreased with increase in the aging time. In addition, the suppression effect of indium on the growth of Cu<inf>3</inf>Sn layer was evident in the post-thermal aging stage with the growth inversely correlated to the indium content. Discussion on the suppression mechanism of indium on the Cu<inf>3</inf>Sn formation is also provided herein.