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Enhanced antimony telluride thermoelectric generators: From material synthesis to device applications
(2025-12-01)
Theekhasuk, Nattharika
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Sakdanuphab, Rachsak
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Voraud, Athorn
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Limsuwan, Pichet
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Sakulkalavek, Aparporn
This study investigates the effect of Bi₄O₄SeCl₂ (BOSC) addition (0–4 wt%) on the thermoelectric performance of p-type Bi₀.₅Sb₁.₅Te₃ synthesized via high-energy ball milling. XRD analysis revealed lattice incorporation at 1 wt% BOSC, while higher concentrations led to phase separation. The 1 wt% BOSC sample exhibited a significantly reduced total thermal conductivity of 0.28 W/m·K, compared to 0.46 W/m·K in the undoped sample, attributed to enhanced phonon scattering. Despite moderate decreases in electrical conductivity and Seebeck coefficient, a peak ZT of 1.02 at 50 °C was achieved—representing a ∼54 % improvement over the undoped material. Furthermore, a prototype thermoelectric module fabricated with BOSC-doped legs produced a power density of 17.6 mW/cm² under a 150 °C temperature gradient. These results demonstrate that BOSC is an effective additive for reducing thermal conductivity and enhancing overall thermoelectric performance, offering potential for energy harvesting applications at moderate temperatures.
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Enhanced thermoelectric properties of bismuth telluride via Ultra-Low thermal conductivity BOSC compound addition
(2024-12-01)
Theekhasuk, Nattharika
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Somdock, Nuttakrit
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Voraud, Athorn
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Limsuwan, Pichet
;
Sakdanuphab, Rachsak
This study aimed to enhance the thermoelectric properties of bismuth telluride by adding Bi<inf>4</inf>O<inf>4</inf>SeCl<inf>2</inf> (BOSC). Commercial N-type bismuth telluride was mixed with BOSC powder in varying concentrations. As the BOSC content increased, the carrier concentration also rose due to chlorine atoms acting as donor impurities. Despite this increase, the power factor values of the samples with BOSC additives did not significantly differ from those of the bare bismuth telluride sample. However, the total thermal conductivity decreased significantly with the addition of BOSC, reaching a minimum value of 0.54 W·m–1·K–1 at 150 °C for the sample with 1 wt% BOSC. Notably, the ZT value for the sample with 1 wt% BOSC was about 0.86, which is four times higher than that of the bare bismuth telluride sample. Our findings demonstrate superior thermoelectric performance, indicating a more efficient modification of thermoelectric properties through the addition of BOSC to the bismuth telluride matrix.
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Enhancing thermoelectric properties of Bi2Te3 film via CuI doping: Sputtering and solid iodination methods verified by ab initio calculation
(2024-04-01)
Khumtong, Tanakorn
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Theekhasuk, Nattharika
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Somdock, Nuttakrit
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Pluengphon, Prayoonsak
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Inceesungvorn, Burapat
We have introduced an innovative method for preparing CuI-doped Bi<inf>2</inf>Te<inf>3</inf> films for the first time, which was also validated through ab initio calculations. The chemical reaction between the Cu-Bi<inf>2</inf>Te<inf>3</inf> film and iodine was conducted using the solid iodination method at room temperature. The results from X-ray diffraction and energy-dispersive spectrometry suggest that the sputtering process, followed by the solid iodination method, holds promise for synthesizing CuI-doped Bi<inf>2</inf>Te<inf>3</inf> films. Additionally, appropriately doping Bi<inf>2</inf>Te<inf>3</inf> with CuI enhances the (00l) crystal orientation, increases carrier concentration and mobility, resulting in improved electrical conductivity. Furthermore, our calculation results align with our experimental findings. An excess of substitutional CuI dopant tends to generate secondary phases, leading to alterations in the intrinsic conductivity and a reduction in the thermoelectric properties of Bi<inf>2</inf>Te<inf>3</inf>. Leveraging the enhanced electrical transport properties achieved through CuI doping, the maximum power factor of the (CuI)<inf>0.2</inf>Bi<inf>2</inf>Te<inf>2.9</inf> film reaches approximately 2.40 × 10−3 W/mK2 at 423 K, representing a 66 % enhancement compared to that of the Bi<inf>2</inf>Te<inf>2.9</inf> film, which has a power factor of 1.44 × 10−3 W/mK2.
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Improving the thermoelectric properties of thick Sb2Te3 film via Cu doping and annealing deposited by DC magnetron sputtering using a mosaic target
(2021-11-01)
Theekhasuk, Nattharika
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Sakdanuphab, Rachsak
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Nuthongkum, Pilaipon
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Pluengphon, Prayoonsak
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Harnwunggmoung, Adul
Thick Cu-doped Sb<inf>2</inf>Te<inf>3</inf> films were deposited on flexible substrate by DC magnetron sputtering from a mosaic Cu–Sb<inf>2</inf>Te<inf>3</inf> target. The Cu-doped Sb<inf>2</inf>Te<inf>3</inf> films were vacuum annealed to improve their thermoelectric properties. Density functional theory was used to clarify the internal mechanism of the Cu doped into the Sb<inf>2</inf>Te<inf>3</inf> system. The results showed that Cu substitution on a Sb site induced electronic states or impurity peaks of Sb<inf>2</inf>Te<inf>3</inf> at a valence band maximum. The carrier concentration of the Cu-doped Sb<inf>2</inf>Te<inf>3</inf> films increased as the Cu-doped concentration increased. However, the crystallite size and Seebeck coefficient of the Cu-doped Sb<inf>2</inf>Te<inf>3</inf> films decreased as the Cu-doped concentration increased. Post-annealing treatment improved the microstructure and thermoelectric properties of the Cu-doped Sb<inf>2</inf>Te<inf>3</inf> films. The maximum electrical conductivity and power factor values of 754.20 S/cm at 50 °C and 1.56 10−3 W/mK2 at 100 °C were obtained in the annealed film with a Cu-doped concentration of 3 at%.

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