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    Item type:Publication,
    Comparison of remineralization in caries-affected dentin using calcium silicate, glass ionomer cement, and resin-modified glass ionomer cement: an in vitro study
    (2025-11-01)
    Youcharoen, Kwanchanok
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    Akkaratham, Onwara
    ;
    Intajak, Papichaya
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    Saikaew, Pipop
    ;
    Chiaraputt, Sirichan
    Objectives: This study evaluated the ability of calcium silicate cement (CSC) as a remineralizing agent compared with conventional glass ionomer cement (GIC) and resin-modified GIC (RMGIC) to remineralize artificial caries-affected dentin. Methods: Twenty-five class V cavities were prepared on extracted human third molars. Twenty teeth underwent artificial caries induction. The remaining five teeth with sound dentin serve as the positive control. The twenty demineralized teeth were subdivided into four groups (n = 5): carious dentin without restoration (negative control [NC]), carious dentin restored with CSC (Biodentine, Septodont), carious dentin restored with GI (Fuji IX, GC Corporation), and carious dentin restored with RMGIC (Fuji II LC, GC Corporation). Following restoration, the specimens were stored in artificial saliva for 7 days. The elastic modulus was evaluated by a nanoindentation test. The mineral composition was analyzed by scanning electron microscopy-energy-dispersive X-ray spectroscopy (SEM-EDX), and the mineral composition at the dentin-material interface. Results: CSC had a higher modulus of elasticity compared to GI, RMGI, and NC groups (p < 0.05). Higher calcium and phosphorus content was observed under CSC restorations, as indicated by SEM-EDX examination, which may lead to better remineralization. Conclusions: Compared to GI and RMGI, CSC showed the best remineralization and mechanical reinforcement in caries-affected dentin, indicating CSC for use in minimally invasive restorative dentistry.
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    Item type:Publication,
    A study on wettability and formation of intermetallic phase between Co–Cr–Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages
    (2020-10-01)
    Kyaw, Tin Tin
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    ; ;
    Yamanaka, Kenta
    ;
    Chiba, Akihiko
    The wettability and formation of intermetallic compounds (IMCs) formed between a Co–Cr–Mo-based alloy and Sn-solder metal were investigated using the reflow soldering method. Soldering was conducted in an electric furnace in separate experiments at temperatures of 533, 553, 573, 623, and 673 K for 600 s. The morphology of the intermetallic layer formed at the Co–Cr–Mo-based/Sn-solder interface was characterized by scanning electron microscopy (SEM). The chemical composition and phase of the formed intermetallic layer were analyzed by electron probe microscopic analysis (EPMA) and X-ray diffraction analysis. Wettability analysis indicated that the soldering temperature influenced the wettability. With increasing soldering temperatures, the spreading factor increased, whereas the contact angle decreased. The intermetallic layers were found in triples in the intermediate zone between the solidified Sn-solder and the Co–Cr–Mo-based substrate. The thickness of the intermetallic layers increased in proportion with increasing soldering temperature. The EPMA analysis indicated only two IMCs formed at the interface of the joint at all of the investigated soldering temperatures, although three interfacial layers were observed by SEM analysis. The Sn-richer phase, Co(Cr,Mo)Sn<inf>2</inf>, formed adjacent to the Sn-solder matrix, whereas the Co(Cr,Mo)Sn was found near the Co–Cr–Mo-based substrate. The nanoindentation measurement revealed that the formed Co(Cr,Mo)Sn<inf>2</inf> and Co(Cr,Mo)Sn IMCs possessed lower hardness values compared to the Sn–Cu intermetallic systems.
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