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    Differential Phase Coupler Using Balun-Type Power Divider
    (2025-05-01)
    Pakasiri, Chatrpol
    ;
    Chang, Chung Yu
    ;
    Wang, Sen
    This paper presents a differential phase coupler design methodology in the IPD process. The coupler consists of a balun and two phase-shifter circuits. The compact balun was designed with lumped components and a common inductor. Each output of the balun circuit was connected to a phase shifter with an opposite phase to make a desired output phase. In the design example, a three-port 90-degree hybrid coupler was implemented on the IPD process to operate at the 6 GHz WIFI frequency. The post-simulation showed that all reflection coefficients were below −19 dB, with an insertion loss of 1.76 dB and isolation of 20 dB. The core chip size was only 0.02λ<inf>0</inf> × 0.018λ<inf>0</inf>.
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    A 10 GHz Compact Balun with Common Inductor on CMOS Process
    (2023-01-01)
    Pakasiri, Chatrpol
    ;
    Xu, Jian Long
    ;
    Wang, Sen
    This paper presents a compact balun with a common inductor design. The design used Wilkinson-type balun topology with modified lumped transmission lines and a common inductor to realize circuit size reduction on a lossy CMOS process. Measurements of the prototype chip had a reflection coefficient below 17.8 dB at all ports, an insertion loss of 1.98 dB, and an isolation of 16.8 dB. The chip size was only 0.025λ<inf>0</inf> × 0.034λ<inf>0</inf>.