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    Multi-Objective Optimization of Mn-Doped Tio2 Content for Wettability, Printability and Intermetallic Layer of Sac305 Pb-Free Solder Paste on a Cu Substrate
    (2021-12-01)
    Kanlayasiri, K.
    ;
    Ariga, T.
    Effects of Mn-doped TiO<inf>2</inf> nanoparticles on the wettability, printability and thickness of intermetallic layer of SAC30 on a Cu substrate were studied in this paper. Concentration of Mn-doped TiO<inf>2</inf> nanoparticles was varied from 0.05 wt.% to 1wt.%. The wettability was evaluated in terms of contact angle of solder on the copper substrate and the printability was measured from the volume ratio of printed solder on the copper substrate to volume of stencil opening. The experimental results showed that 0.10wt.% Mn-doped TiO<inf>2</inf> led to the lowest contact angle while the printability was decreased with the increase of the added nanoparticles and the thinnest intermetallic layer was found at 0.50wt.% Mn-doped TiO<inf>2</inf> nanoparticles. Mn-doped TiO<inf>2</inf> concentration was then optimized using a desirability function to find optimal values for the three responses. It was found that 0.07wt.% was the optimal concentration for the three metrics — wettability, printability and thickness of the intermetallic layer.
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    Quality Investigation of surface mount technology using phase-shifting digital holography
    (2016-01-01)
    Boonsri, Chantira
    ;
    Buranasiri, Prathan
    Applying of a phase-shifting digital holography combined with compressive sensing to inspect the soldering quality of surface mount technology (SMT) which is a method for producing electronic circuits. In SMT, the components are mounted and connected with each other directly onto the surface of printed circuit boards (PCBs). By reconstructing the multidimensional images from a few samples of SMT, the results are solved by an optimization problem. In this paper, two problems have been concerned. The first one is to examine the devices and the soldering quality of connections between them, which are in micro-scaled. The second is to observe the effect of heat treatment of soldering material and devices on the surface mount board.
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