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Author: search.filters.author.KANLAYASIRI, KannachaiSubject: search.filters.subject.microstructure

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    Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders
    (2022-04-01)
    KANLAYASIRI, Kannachai
    ;
    MOOKAM, Niwat
    The effect of Cu content on the microstructure, grain orientation and mechanical properties of Sn–xCu (x=0–4.0 wt.%) lead-free solder was studied. Results showed that added Cu induced the formation of intermetallic phases. Only the η-Cu<inf>6</inf>Sn<inf>5</inf> and ɛ-Cu<inf>3</inf>Sn phases were present in the β-Sn matrix. For all contents, the strongly preferred orientation of the β-Sn phase was formed on the {001} plane. In Sn doped with 1.0 wt.% Cu, the η-Cu<inf>6</inf>Sn<inf>5</inf> phase exhibited the preferred orientation of {0001} plane, whereas doping with 3.0 or 4.0 wt.% Cu transformed the preferred orientation to the {010} plane. In addition, only the {0001} and planes were present in the ɛ-Cu<inf>3</inf>Sn phase. The high Cu contents contributed to an increased number of low-angle boundaries, high residual strain, tensile strength and microhardness.
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    Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate
    (2019-08-01)
    TUNTHAWIROON, Phacharaphon
    ;
    KANLAYASIRI, Kannachai
    The effects of Ag on the microstructure and corrosion behavior of pre-soldering Sn–xAg lead-free solders, and on the formation of intermetallic layer of the solders with Cu substrate were investigated. The Ag contents (x) were 0, 3.0, 3.5, 4.0, and 5.0 wt.%. The Ag content played a role in the morphology of Ag<inf>3</inf>Sn phase in the solders. The microstructure analysis showed that the β-Sn phase was surrounded by eutectic networks in the 3.0Ag and 3.5Ag solders and large plate-like Ag<inf>3</inf>Sn formed in the 4.0Ag and 5.0Ag solders. Nonetheless, the Ag content slightly impacted the corrosion behavior of the as-cast solders as characterized using potentiodynamic polarization test. After soldering, only a single layer of a Cu<inf>6</inf>Sn<inf>5</inf> intermetallic compound formed at the Sn–xAg/Cu interface. By comparison, the Cu<inf>6</inf>Sn<inf>5</inf> intermetallic layer of the Ag-doped solders was thinner than that of the 0Ag solder. The fine Ag<inf>3</inf>Sn particles in the eutectic networks precipitating in the 3.0Ag and 3.5Ag solders effectively hindered the growth of Cu<inf>6</inf>Sn<inf>5</inf> grains compared to large plate-like Ag<inf>3</inf>Sn in the 4.0 and 5.0Ag solders.