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Author: search.filters.author.Kanlayasiri, KannachaiSubject: search.filters.subject.Metals and alloys

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    Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate
    (2016-05-25)
    Kanlayasiri, Kannachai
    ;
    Sukpimai, Kamtorn
    This research has investigated the effects of indium on the intermetallic layer formation attributable to the reaction between low-Ag SAC0307-xIn lead-free solder and a Cu substrate, where x = 0, 0.5, 1.0, 1.5, 2.0, 2.5 and 3.0 wt%. This study has also examined the post-soldering and post-thermal aging interfacial layers. Morphology parameters were utilized to represent the shape of total intermetallic layer at the interface. The findings indicated that indium had no effect on the pre- and post-aging intermetallic layer overall thicknesses but lowered the Cu<inf>3</inf>Sn/Cu<inf>6</inf>Sn<inf>5</inf> thickness ratio; and that the concentrations of indium exhibited no influence over the post-soldering and post-thermal aging morphology parameter values. In the experiments, the morphology parameter value decreased with increase in the aging time. In addition, the suppression effect of indium on the growth of Cu<inf>3</inf>Sn layer was evident in the post-thermal aging stage with the growth inversely correlated to the indium content. Discussion on the suppression mechanism of indium on the Cu<inf>3</inf>Sn formation is also provided herein.
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    Effect of soldering condition on formation of intermetallic phases developed between Sn-0.3Ag-0.7Cu low-silver lead-free solder and Cu substrate
    (2011-05-26)
    Mookam, Niwat
    ;
    Kanlayasiri, Kannachai
    In this paper, effect of soldering time and temperature on formation of intermetallic compounds developed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate was investigated. Dip soldering was performed at 250, 270, and 290 °C with soldering time of 5, 10, 15, and 20 s. Either ε-Cu <inf>3</inf>Sn or η-Cu<inf>6</inf>Sn<inf>5</inf> intermetallic phase was found at the interface between the solder and the substrate depending on the soldering condition, i.e., soldering time and soldering temperature. ε-Cu<inf>3</inf>Sn was found only when the substrate was soldered at 250 °C for 5 and 10 s. At other soldering conditions, only η-Cu <inf>6</inf>Sn<inf>5</inf> was found at the interfacial zone. Crystal structure of ε-Cu<inf>3</inf>Sn intermetallic phase was orthorhombic, and it was hexagonal structure for η-Cu<inf>6</inf>Sn<inf>5</inf>. Transformation of the intermetallic phases was also discussed. © 2011 Elsevier B.V. All rights reserved.
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    Influence of thermal aging on microhardness and microstructure of Sn-0.3Ag-0.7Cu-xIn lead-free solders
    (2010-08-31)
    Kanlayasiri, Kannachai
    ;
    Ariga, Tadashi
    Sn-0.3Ag-0.7Cu is a low-silver lead-free solder, and provides a thinner brittle Ag<inf>3</inf>Sn intermetallic layer during soldering process. In this paper, effects of thermal aging on microhardness, and microstructure of Sn-0.3Ag-0.7Cu-xIn lead-free solders were investigated. Indium was added to lower the melting temperature, and varied from 0.0 to 3.0 wt%. The solders were thermally aged at 100 °C for 1, 10, 100, and 1000 h. Results showed that microhardness of the solders decreases as the aging time increases, and average grain size of the microstructure is larger with the increase of the aging time. It was also found that the higher In content in the solder provides the greater decreasing rate of its microhardness. © 2010 Elsevier B.V. All rights reserved.
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    Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloy
    (2009-10-19)
    Kanlayasiri, Kannachai
    ;
    Mongkolwongrojn, Mongkol
    ;
    Ariga, Tadashi
    Effects of indium (In) addition on solidus and liquidus temperatures, wetting time, wetting force, tensile strength, and microhardness of Sn-0.3Ag-0.7Cu lead-free solder alloy were investigated in this paper. Indium was added and varied from 0 to 3 wt%. It is found that solidus and liquidus temperatures of the solder alloy are lowered as the In content is increased. However, In also increases the melting range between solidus and liquidus temperatures. Wetting time of the solder alloy is reduced by the addition of In while the wetting force is increased with the increase of In content. With the addition of In, the Sn-rich phase is smaller in size, and the intermetallic compounds are more uniformly distributed. As a result, tensile strength and microhardness of Sn-0.3Ag-0.7Cu are increased when In is added into the solder alloy. © 2009 Elsevier B.V. All rights reserved.