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Author: search.filters.author.Mookam, NiwatSubject: search.filters.subject.Intermetallics

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    Evolution of Intermetallic Compounds between Sn-0.3Ag-0.7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging
    (2012-01-01)
    Mookam, Niwat
    ;
    Kanlayasiri, Kannachai
    The growth, transformation, and lattice structure of intermetallic compounds formed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate were investigated. Dip soldering was used to initiate the reaction between the solder and substrate. An η-Cu <inf>6</inf>Sn <inf>5</inf> intermetallic phase possessing a hexagonal lattice structure was found at the as-soldered interface. Thermal aging at a number of conditions resulted in the formation of a Cu <inf>3</inf>Sn intermetallic phase between the Cu <inf>6</inf>Sn <inf>5</inf> layer and the copper substrate. e{open}-Cu <inf>3</inf>Sn with an orthorhombic lattice structure was found together with hexagonal Cu <inf>3</inf>Sn. Subsequently, the activation energies of the intermetallic phases were calculated and compared to results obtained from the literature. The comparison showed that good agreement existed between the findings from this study and literature data within a similar temperature range. © 2012 The Chinese Society for Metals.
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    Effect of soldering condition on formation of intermetallic phases developed between Sn-0.3Ag-0.7Cu low-silver lead-free solder and Cu substrate
    (2011-05-26)
    Mookam, Niwat
    ;
    Kanlayasiri, Kannachai
    In this paper, effect of soldering time and temperature on formation of intermetallic compounds developed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate was investigated. Dip soldering was performed at 250, 270, and 290 °C with soldering time of 5, 10, 15, and 20 s. Either ε-Cu <inf>3</inf>Sn or η-Cu<inf>6</inf>Sn<inf>5</inf> intermetallic phase was found at the interface between the solder and the substrate depending on the soldering condition, i.e., soldering time and soldering temperature. ε-Cu<inf>3</inf>Sn was found only when the substrate was soldered at 250 °C for 5 and 10 s. At other soldering conditions, only η-Cu <inf>6</inf>Sn<inf>5</inf> was found at the interfacial zone. Crystal structure of ε-Cu<inf>3</inf>Sn intermetallic phase was orthorhombic, and it was hexagonal structure for η-Cu<inf>6</inf>Sn<inf>5</inf>. Transformation of the intermetallic phases was also discussed. © 2011 Elsevier B.V. All rights reserved.