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Item type:Item, The Development of a High-Efficiency Small Induction Furnace for a Glass Souvenir Production Process Using Multiphysics(2024-09-01) ;Thongsri, Jatuporn ;Poopanya, Piyawong ;Sriphalang, SanguansakPattanapichai, SorathornA small induction furnace (SIF), which has the important components of copper coils, a ceramic jig, and a graphite crucible, employed for a glass souvenir production process, has been developed as a form of clean technology for multiphysics, consisting of electromagnetics analysis (EA) and thermal analysis (TA). First, two experiments were established to measure parameters for multiphysics results validation and boundary condition settings. Then, the parameters were applied to multiphysics, in which the EA revealed magnetic flux density (B) and ohmic losses, and the TA reported a temperature consistent with the experimental results, confirming the multiphysics credibility. Next, a ferrite flux concentrator was added to the SIF during development. Multiphysics revealed that PC40 ferrite, as a flux concentrator with a suitable design, could increase B by about 159% compared to the conventional SIF at the power of 1000 W. As expected, the B increases alongside the increase in power applied to the coils, and is more densely concentrated in the flux concentrator than in other regions, enhancing the production process efficacy. Lastly, the developed SIF was employed in the actual process and received good feedback from users. The novel research findings are the developed SIF and methodology, exclusively designed for this research and practically employed for a glass souvenir production process. - Some of the metrics are blocked by yourconsent settings
Item type:Item, Multiphysics to Investigate the Thermal and Mechanical Responses in Hard Disk Drive Components Due to the Reflow Soldering Process(2024-09-01) ;Kimaporn, Napatsorn ;Samakkarn, ChawitThongsri, JatupornIn hard disk drive (HDD) manufacturing, a reflow soldering process (RSP) implements heat generated by the welding tip to melt a solder ball for bonding the following essential HDD components: a flexible printed circuit (FPC) and a printed circuit cable (PCC). Since the mentioned components are tiny and comprise many thin material layers, an experiment to study thermal and mechanical responses is complex and not worth it. Therefore, a static state multiphysics consisting of thermal analysis (TA) and structural analysis (SA) was employed to investigate both responses. First, the experiment was established to mimic the RSP, measuring the temperature generated by the actual welding tip. Then, the measured temperature was defined as the boundary conditions with the pressing force (F) for the TA and SA based on the actual operating conditions. As expected, the TA results revealed the temperature distribution in the HDD components, which was consistent with the theory and results from previous work and confirmed this work’s credibility. Significantly, the SA reported severe total deformation (δ) in FPC’s top and bottom ends. The maximum δ was 0.72–0.88 mm for the F of 0–1 N. The stronger the F, the greater the δ. This research highlights that multiphysics can investigate both responses in HDD components as slight as 0.1–100 microns thick, which can be used to develop a high-efficacy RSP. - Some of the metrics are blocked by yourconsent settings
Item type:Item, Development of a Small Ultrasonic Cleaning Bath based on Harmonic Response Analysis(2024-01-01) ;Worradechaudom, Warakorn ;Chaiaiad, ChatchapatThongsri, JatupornThis article reports the development of a 0.27 L small ultrasonic cleaning bath (SUCB) with a 45 kHz single transducer to enhance cleaning efficacy based on harmonic response analysis (HRA). First, the HRA results revealed the uneven acoustic pressure inside the SUCB emerged from the transducer, depending on the applied voltage. As expected, the higher the applied voltage, the greater the acoustic pressure, and away from the transducer, the acoustic pressure decreased, consistent with the foil corrosion test, confirming the research methodology's credibility. Then, the transducer has been redesigned to develop the SUCB. Last, using the HRA, the simulation results indicated that the redesigned transduce, adding front and back masses like a horn shape, enhanced the acoustic pressure and helped to increase cleaning efficacy compared to the conventional SUCB. The findings were applied to develop a new generation of the SUCB. This article presents a step-by-step HRA technique that can be practically used in manufacturing design. - Some of the metrics are blocked by yourconsent settings
Item type:Item, Transient Thermal-Electric Analysis of Peltier Cooling Plate for Developing a Mini Refrigerator(2024-01-01) ;Chaiaiad, ChatchapatThongsri, JatupornThis article reports a transient thermal-electric analysis (TEA), a simulation of a Peltier cooling plate (PCP) aimed to develop into a mini refrigerator soon. This conventional PCP includes 110 Peltier cells, which are a series of connecting cells, and two sandwiched ceramic plates. First, the experiment measured the PCP's applied current (I) and temperature (T) under the desired conditions. Then, the TEA was employed to determine the I and T of the PCP, which were compared with the experimental results. As expected, the comparison shows the consistency between the simulation and experimental results, validating the credibility of the methodology and simulation results. The simulation results revealed that the temperature difference (Δ T) between the two sandwiched ceramic plates increased with the increase of I and the number of cells, as expected. Last, the proposed model of PCP, I of 500 mA, 126 Peltier cells, and reducing the gap between cells, could generate T of -2.3761C on the cool ceramic plate lower than the conventional model of -1.6495 C, about 44% reduction at the same I, suitable for developing the mini refrigerator. The novel of this article is the practical methodology of using transient TEA to help design the PCP for specific purposes. - Some of the metrics are blocked by yourconsent settings
Item type:Item, A Development of Welding Tips for the Reflow Soldering Process Based on Multiphysics(2022-11-01) ;Thongsri, JatupornJansaengsuk, ThodsaphonA reflow soldering process (RSP) is generally implemented in advanced manufacturing factories for welding small electronic components together to create a product using heat generated at the welding tip (WT). Improper WT design and operating conditions may lead to defects in some products; therefore, optimizing both is immensely significant in developing the RSP. Accordingly, this article proposes a successful RSP development based on multiphysics in a hard disk drive factory consisting of transient thermal-electric and structural simulations. First, a new shape series WT was designed, and a conventional shape, parallel WT, was considered as a case study. Then, they were assembled and experimented with the RSP actual operating conditions to collect essential data. Next, the heat transfer was determined using a transient thermal-electric simulation (TES). The simulation results showed uneven WT temperatures depending on applied voltages, time, and shapes, which were consistent with the experimental results. The higher the applied voltage, the greater the temperature generated at the WT. Finally, after using TES results as loads, the structural simulation showed WT total deformations, which could be consistent with actually occurring defects. The findings from this research are a new design of series WT and proper multiphysics methodology for developing the RSP. - Some of the metrics are blocked by yourconsent settings
Item type:Item, Gas Flow and Ablation of 122 mm Supersonic Rocket Nozzle Investigated by Conjugate Heat Transfer Analysis(2022-09-01) ;Thongsri, Jatuporn ;Srathonghuam, KamonwanBoonpan, AdulyasakThe propellant gas flow of a supersonic rocket in inappropriate operating conditions can cause excessive ablation inside a nozzle. In this research, conjugate heat transfer analysis (CHTA), consisting of computational fluid dynamics (CFD) and finite element analysis (FEA), was applied to investigate the gas flow and ablation of a 122 mm nozzle as a case study in the transient state, based on actual operating conditions. First, the nozzle was tested in a static experiment. Then, the experimental results were employed for CHTA settings and validation. Next, after completing the CFD calculation, the results revealed that the nozzle’s gas flow, temperature, pressure, Mach number, shock, etc. were consistent with theoretical results. Finally, using the CFD results as loads, the FEA results showed the equivalent von Mises stress (σ<inf>v</inf>), which was consistent with the ablation results from the experiment, as expected. The more the σ<inf>v</inf>, the greater the ablation. Both σ<inf>v</inf> and ablation were high near the throat and decreased further away. In addition, increasing the insulators’ thickness reduced σ<inf>v</inf>, leading to ablation reduction. The research findings contribute to an understanding of ablation and the methodology of employing CHTA to improve the design of 122 mm and other nozzles with reduced ablation for higher efficacy. - Some of the metrics are blocked by yourconsent settings
Item type:Item, A simulation of swage process for hard disk drive factory based on explicit dynamics analysis(2022-01-01) ;Bubpatha, WatcharaThongsri, JatupornNowadays, the hard disk drive (HDD) industry is very competitive and focuses on enhancing the performance and capacity of HDD. To serve these purposes, HDD manufacturers prefer to increase the number of media, thus adding more head gimbal assemblies (HGAs) as well. A swage process (SP) assembles between HGAs and arm actuators into a head stack assembly (HSA). The greater the number of HGAs, the thinner it gets. Such thinness in some products, after passing the SP, there could be higher deformation and stress in arm actuators than expected values. To investigate and understand this problem. This article proposes an explicit dynamic analysis (EDA) in ANSYS software to solve the problem and simulate the SP using an actual condition from a manufacturer. The EDA provides simulation results that are consistent with the experimental results. The analytical results lead to understanding the SP's deformation, strain, and lubricant effect. Therefore, the EDS is a precise and appropriate method for developing the SP in the HDD manufacturing process.
