KMITL

Permanent URI for this communityhttps://dspace.kmitl.ac.th/handle/123456789/1

Browse

Settings

Author: search.filters.author.Thongsri, JatupornSubject: search.filters.subject.heat transfer

Search Results

Now showing 1 - 4 of 4
  • Loading...
    Thumbnail Image
    Some of the metrics are blocked by your 
    consent settings
    Item type:Item,
    A Feasibility Study for the Hot-Air-Assisted Reflow Soldering Process Based on Computational Fluid Dynamics
    (2024-10-01)
    Kanjad, Natcha
    ;
    Chanbandit, Chanapat
    ;
    Thongsri, Jatuporn
    In hard disk drive (HDD) manufacturing, a reflow soldering process (RSP) employs heat generated at the welding tip (WT) to bond tiny electrical components for assembling an HDD. Generally, the heat was generated by an electric current applied to the WT. This article reports a feasibility study of using hot air based on computational fluid dynamics (CFD), a choice to assist heat generation. First, the WT and hot air tube (HAT) prototypes were designed and created. The HAT is a device that helps to supply hot air directly to generate heat at the WT. Then, the experiment was established to measure the temperature (T) supplied by the hot air. The measure results were employed to validate the CFD results. Next, the prototype HAT was used to investigate the T generated at the WT by CFD. The comparison revealed that the T measured by the experiment was in the 106.2 °C–133.5 °C range and that the CFD was in the 107.3 °C–136.6 °C range. The maximum error of the CFD results is 2.3% compared to the experimental results, confirming the credibility of the CFD results and methodology. The CFD results revealed that the operating conditions, such as WT, HAT designs, hot air inlet velocity, and inlet temperature, influence the T. Last, examples of suitable operating conditions for using hot air were presented, which confirmed that hot air is a proper choice for a low-temperature RPS.
  • Loading...
    Thumbnail Image
    Some of the metrics are blocked by your 
    consent settings
    Item type:Item,
    The Development of a High-Efficiency Small Induction Furnace for a Glass Souvenir Production Process Using Multiphysics
    (2024-09-01)
    Thongsri, Jatuporn
    ;
    Poopanya, Piyawong
    ;
    Sriphalang, Sanguansak
    ;
    Pattanapichai, Sorathorn
    A small induction furnace (SIF), which has the important components of copper coils, a ceramic jig, and a graphite crucible, employed for a glass souvenir production process, has been developed as a form of clean technology for multiphysics, consisting of electromagnetics analysis (EA) and thermal analysis (TA). First, two experiments were established to measure parameters for multiphysics results validation and boundary condition settings. Then, the parameters were applied to multiphysics, in which the EA revealed magnetic flux density (B) and ohmic losses, and the TA reported a temperature consistent with the experimental results, confirming the multiphysics credibility. Next, a ferrite flux concentrator was added to the SIF during development. Multiphysics revealed that PC40 ferrite, as a flux concentrator with a suitable design, could increase B by about 159% compared to the conventional SIF at the power of 1000 W. As expected, the B increases alongside the increase in power applied to the coils, and is more densely concentrated in the flux concentrator than in other regions, enhancing the production process efficacy. Lastly, the developed SIF was employed in the actual process and received good feedback from users. The novel research findings are the developed SIF and methodology, exclusively designed for this research and practically employed for a glass souvenir production process.
  • Loading...
    Thumbnail Image
    Some of the metrics are blocked by your 
    consent settings
    Item type:Item,
    Multiphysics to Investigate the Thermal and Mechanical Responses in Hard Disk Drive Components Due to the Reflow Soldering Process
    (2024-09-01)
    Kimaporn, Napatsorn
    ;
    Samakkarn, Chawit
    ;
    Thongsri, Jatuporn
    In hard disk drive (HDD) manufacturing, a reflow soldering process (RSP) implements heat generated by the welding tip to melt a solder ball for bonding the following essential HDD components: a flexible printed circuit (FPC) and a printed circuit cable (PCC). Since the mentioned components are tiny and comprise many thin material layers, an experiment to study thermal and mechanical responses is complex and not worth it. Therefore, a static state multiphysics consisting of thermal analysis (TA) and structural analysis (SA) was employed to investigate both responses. First, the experiment was established to mimic the RSP, measuring the temperature generated by the actual welding tip. Then, the measured temperature was defined as the boundary conditions with the pressing force (F) for the TA and SA based on the actual operating conditions. As expected, the TA results revealed the temperature distribution in the HDD components, which was consistent with the theory and results from previous work and confirmed this work’s credibility. Significantly, the SA reported severe total deformation (δ) in FPC’s top and bottom ends. The maximum δ was 0.72–0.88 mm for the F of 0–1 N. The stronger the F, the greater the δ. This research highlights that multiphysics can investigate both responses in HDD components as slight as 0.1–100 microns thick, which can be used to develop a high-efficacy RSP.
  • Loading...
    Thumbnail Image
    Some of the metrics are blocked by your 
    consent settings
    Item type:Item,
    A Development of Welding Tips for the Reflow Soldering Process Based on Multiphysics
    (2022-11-01)
    Thongsri, Jatuporn
    ;
    Jansaengsuk, Thodsaphon
    A reflow soldering process (RSP) is generally implemented in advanced manufacturing factories for welding small electronic components together to create a product using heat generated at the welding tip (WT). Improper WT design and operating conditions may lead to defects in some products; therefore, optimizing both is immensely significant in developing the RSP. Accordingly, this article proposes a successful RSP development based on multiphysics in a hard disk drive factory consisting of transient thermal-electric and structural simulations. First, a new shape series WT was designed, and a conventional shape, parallel WT, was considered as a case study. Then, they were assembled and experimented with the RSP actual operating conditions to collect essential data. Next, the heat transfer was determined using a transient thermal-electric simulation (TES). The simulation results showed uneven WT temperatures depending on applied voltages, time, and shapes, which were consistent with the experimental results. The higher the applied voltage, the greater the temperature generated at the WT. Finally, after using TES results as loads, the structural simulation showed WT total deformations, which could be consistent with actually occurring defects. The findings from this research are a new design of series WT and proper multiphysics methodology for developing the RSP.