KMITL

Permanent URI for this communityhttps://dspace.kmitl.ac.th/handle/123456789/1

Browse

Settings

Subject: search.filters.subject.Ag3Sn intermetallic phase

Search Results

Now showing 1 - 1 of 1
  • Loading...
    Thumbnail Image
    Some of the metrics are blocked by your 
    consent settings
    Item type:Item,
    Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate
    (2019-08-01)
    TUNTHAWIROON, Phacharaphon
    ;
    KANLAYASIRI, Kannachai
    The effects of Ag on the microstructure and corrosion behavior of pre-soldering Sn–xAg lead-free solders, and on the formation of intermetallic layer of the solders with Cu substrate were investigated. The Ag contents (x) were 0, 3.0, 3.5, 4.0, and 5.0 wt.%. The Ag content played a role in the morphology of Ag<inf>3</inf>Sn phase in the solders. The microstructure analysis showed that the β-Sn phase was surrounded by eutectic networks in the 3.0Ag and 3.5Ag solders and large plate-like Ag<inf>3</inf>Sn formed in the 4.0Ag and 5.0Ag solders. Nonetheless, the Ag content slightly impacted the corrosion behavior of the as-cast solders as characterized using potentiodynamic polarization test. After soldering, only a single layer of a Cu<inf>6</inf>Sn<inf>5</inf> intermetallic compound formed at the Sn–xAg/Cu interface. By comparison, the Cu<inf>6</inf>Sn<inf>5</inf> intermetallic layer of the Ag-doped solders was thinner than that of the 0Ag solder. The fine Ag<inf>3</inf>Sn particles in the eutectic networks precipitating in the 3.0Ag and 3.5Ag solders effectively hindered the growth of Cu<inf>6</inf>Sn<inf>5</inf> grains compared to large plate-like Ag<inf>3</inf>Sn in the 4.0 and 5.0Ag solders.