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Subject: search.filters.subject.Lead-free solder

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    Effects of Ni Content on Melting Behaviors and Wettability of SnBiAgNi Lead-Free Solder
    (2022-01-01)
    Mookam, Niwat
    ;
    Jattakul, Prajak
    ;
    Kanlayasiri, Kannachai
    This research aimed to study the effects of Ni content on melting behaviors and wettability of SnBiAgNi lead-free solder. Sn-58Bi-0.05Ag was used as the base solder, and Ni was then put in by 0.05, 0.10, 0.50 or 1.00 wt%. Solidus and liquidus temperatures of the solder alloys were examined to study melting behaviors. The Ni content changed the solidus and liquidus temperatures, and Sn-58Bi-0.05Ag-0.10Ni possessed the lowest solidus and liquidus temperatures. Sn-58Bi-0.05Ag-0.10Ni also provided the narrowest pasty range. Wettability of the solders on the copper substrate was expressed in terms of spread factor. The addition of Ni improved the wettability of the base solder, and Sn-58Bi-0.05Ag-0.10Ni provided the highest spread factor.
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    Multi-Objective Optimization of Mn-Doped Tio2 Content for Wettability, Printability and Intermetallic Layer of Sac305 Pb-Free Solder Paste on a Cu Substrate
    (2021-12-01)
    Kanlayasiri, K.
    ;
    Ariga, T.
    Effects of Mn-doped TiO<inf>2</inf> nanoparticles on the wettability, printability and thickness of intermetallic layer of SAC30 on a Cu substrate were studied in this paper. Concentration of Mn-doped TiO<inf>2</inf> nanoparticles was varied from 0.05 wt.% to 1wt.%. The wettability was evaluated in terms of contact angle of solder on the copper substrate and the printability was measured from the volume ratio of printed solder on the copper substrate to volume of stencil opening. The experimental results showed that 0.10wt.% Mn-doped TiO<inf>2</inf> led to the lowest contact angle while the printability was decreased with the increase of the added nanoparticles and the thinnest intermetallic layer was found at 0.50wt.% Mn-doped TiO<inf>2</inf> nanoparticles. Mn-doped TiO<inf>2</inf> concentration was then optimized using a desirability function to find optimal values for the three responses. It was found that 0.07wt.% was the optimal concentration for the three metrics — wettability, printability and thickness of the intermetallic layer.
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    Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate
    (2016-05-25)
    Kanlayasiri, Kannachai
    ;
    Sukpimai, Kamtorn
    This research has investigated the effects of indium on the intermetallic layer formation attributable to the reaction between low-Ag SAC0307-xIn lead-free solder and a Cu substrate, where x = 0, 0.5, 1.0, 1.5, 2.0, 2.5 and 3.0 wt%. This study has also examined the post-soldering and post-thermal aging interfacial layers. Morphology parameters were utilized to represent the shape of total intermetallic layer at the interface. The findings indicated that indium had no effect on the pre- and post-aging intermetallic layer overall thicknesses but lowered the Cu<inf>3</inf>Sn/Cu<inf>6</inf>Sn<inf>5</inf> thickness ratio; and that the concentrations of indium exhibited no influence over the post-soldering and post-thermal aging morphology parameter values. In the experiments, the morphology parameter value decreased with increase in the aging time. In addition, the suppression effect of indium on the growth of Cu<inf>3</inf>Sn layer was evident in the post-thermal aging stage with the growth inversely correlated to the indium content. Discussion on the suppression mechanism of indium on the Cu<inf>3</inf>Sn formation is also provided herein.
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    Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate
    (2015-12-05)
    Kanlayasiri, Kannachai
    ;
    Ariga, Tadashi
    The aims of this research are to investigate the effects of Ni on the physical properties of Sn58Bi-xNi lead-free solder, and to examine its interfacial reaction with the copper substrate. In the experiments, four concentrations of Ni (i.e. 0.05, 0.1, 0.5 and 1.0wt.%) were individually added into Sn58Bi and their respective microstructure, tensile strength, elongation, melting temperature, wettability and electrical resistivity of Sn58Bi-xNi were subsequently measured. The results indicated that Ni refined the microstructure of the solder matrix and induced the formation of Ni<inf>3</inf>Sn<inf>4</inf> intermetallic phase, and that the size and volume fraction of Ni<inf>3</inf>Sn<inf>4</inf> were positively correlated to the Ni content. The optimal concentration of Ni to enhance the tensile strength of the alloy was 0.1wt.%, but the elongation of the alloy was inversely correlated to the Ni content. The addition of Ni contributed positively to the melting temperature and wetting behavior of the alloy, whereas no significant change in the electrical resistivity of Sn58Bi-xNi was detected. In addition, Ni increased the thickness of the intermetallic layer at the interface, and only monoclinic η'-Cu<inf>6</inf>Sn<inf>5</inf> phase was present at the intermetallic layer. Nevertheless, the intermetallic phase of this research was dissimilar from the findings of existing literature.