Kanlayasiri, Kannachai

Preferred name

Alternative Name

KANLAYASIRI, Kannachai

Kanlayasiri, K.

Main Affiliation

School of Engineering

kannachai.ka@kmitl.ac.th

Now showing 1 - 10 of 24

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Multi-Objective Optimization of Mn-Doped Tio2 Content for Wettability, Printability and Intermetallic Layer of Sac305 Pb-Free Solder Paste on a Cu Substrate
(2021-12-01)
Kanlayasiri, K.
;
Ariga, T.
Effects of Mn-doped TiO<inf>2</inf> nanoparticles on the wettability, printability and thickness of intermetallic layer of SAC30 on a Cu substrate were studied in this paper. Concentration of Mn-doped TiO<inf>2</inf> nanoparticles was varied from 0.05 wt.% to 1wt.%. The wettability was evaluated in terms of contact angle of solder on the copper substrate and the printability was measured from the volume ratio of printed solder on the copper substrate to volume of stencil opening. The experimental results showed that 0.10wt.% Mn-doped TiO<inf>2</inf> led to the lowest contact angle while the printability was decreased with the increase of the added nanoparticles and the thinnest intermetallic layer was found at 0.50wt.% Mn-doped TiO<inf>2</inf> nanoparticles. Mn-doped TiO<inf>2</inf> concentration was then optimized using a desirability function to find optimal values for the three responses. It was found that 0.07wt.% was the optimal concentration for the three metrics — wettability, printability and thickness of the intermetallic layer.
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Property alterations of Sn-0.6Cu-0.05Ni-Ge lead-free solder by Ag, Bi, In and Sb addition
(2018-06-01)
KANLAYASIRI, Kannachai
;
KONGCHAYASUKAWAT, Rachata
The Sn-Cu-Ni-Ge solder is a strong challenger to the Sn-Ag-Cu (SAC) solders as a replacement for the Sn-Pb eutectic solder. This research investigated the effects of addition of Ag, Bi, In, and Sb on the physical properties of the Sn-0.6Cu-0.05Ni-Ge (SCNG) lead-free solder and the interfacial reaction with the Cu substrate. The melting behavior, microstructure, tensile strength, and wettability of the SCNG–x (x=Ag, Bi, In, Sb) solders were examined. The findings revealed that the introduction of Ag, Bi, In, and Sb minimally altered the solidus temperature, liquidus temperature, and tensile strength of the solder. However, the cooling behavior and solidified microstructure of the solder were affected by the concentration of the alloying elements. The wettability of the SCNG solder was improved with the doping of the alloying elements except Sb. The thickness of intermetallic layer was increased by the addition of the alloying elements and was related to the cooling behavior of the solder. The morphology of intermetallic layer between the SCNG–x solders and the Cu substrate was different from that of the typical SAC solders. In conclusion, alloying the SCNG solder with Ag, Bi, In or Sb is able to improve particular properties of the solder.
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Effects of substrate annealing on wettability and intermetallic compound formation in Sn–3.0Cu/Cu systems
(2019-07-01)
Mookam, Niwat
;
Kanlayasiri, Kannachai
This paper investigates the effects of Cu substrate annealing on the wettability of Sn–3.0Cu lead-free solder and the subsequent growth of the intermetallic compounds that are formed at the interface between the solder and the substrate. The annealing processes yielded various grain sizes, grain orientations, and residual strains within the substrates. Then, effects of the Cu substrates on the wetting and intermetallic formation were studied via reflow soldering using Sn–3.0Cu lead-free solder. The annealed substrates were compared to an unannealed Cu reference at soldering times of 20, 40, 60 and 120 s. The experimental results demonstrated that the substrate grain orientation, residual strain and grain size exert no influence on the solder wettability. After soldering, only a η-Cu<inf>6</inf>Sn<inf>5</inf> intermetallic compound was observed in the interfacial layer for both the reference and annealed copper substrates. The thickness of the η-Cu<inf>6</inf>Sn<inf>5</inf> layer was found to be independent of the substrate grain size but increased as the misorientation angle and the residual strain in the substrate increased.
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Effects of indium on the intermetallic layer between low-Ag SAC0307-xIn lead-free solders and Cu substrate
(2016-05-25)
Kanlayasiri, Kannachai
;
Sukpimai, Kamtorn
This research has investigated the effects of indium on the intermetallic layer formation attributable to the reaction between low-Ag SAC0307-xIn lead-free solder and a Cu substrate, where x = 0, 0.5, 1.0, 1.5, 2.0, 2.5 and 3.0 wt%. This study has also examined the post-soldering and post-thermal aging interfacial layers. Morphology parameters were utilized to represent the shape of total intermetallic layer at the interface. The findings indicated that indium had no effect on the pre- and post-aging intermetallic layer overall thicknesses but lowered the Cu<inf>3</inf>Sn/Cu<inf>6</inf>Sn<inf>5</inf> thickness ratio; and that the concentrations of indium exhibited no influence over the post-soldering and post-thermal aging morphology parameter values. In the experiments, the morphology parameter value decreased with increase in the aging time. In addition, the suppression effect of indium on the growth of Cu<inf>3</inf>Sn layer was evident in the post-thermal aging stage with the growth inversely correlated to the indium content. Discussion on the suppression mechanism of indium on the Cu<inf>3</inf>Sn formation is also provided herein.
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Effect of bending temperatures on the microstructure and springback of a TRIP steel sheet
(2020-10-01)
Pornputsiri, Natthasak
;
Kanlayasiri, Kannachai
Transformation-induced plasticity (TRIP) steel possesses high strength and formability, enabling the use of a thinner gauge material and allowing for the fabrication of complex shapes. In this research, we measured the effect of bending temperatures on the microstructure and air-bending springback angle of TRIP steel at temperatures from 25 to 600 °C. Real-time in situ X-ray diffraction and scanning electron microscopy were used for pre- and postbending analysis. As the prebending temperature increased from 25 °C to 600 °C, the retained austenite (RA) volume fraction decreased, and the RA transformed to bainite at temperatures above 400 °C. The springback angle was positively correlated with the prebending RA volume fraction, with the smallest springback angle achieved at 400 °C. Additionally, the springback angle was positively correlated with the bending angle, because the RA transformation ratio contributed to increased strain hardening. Further microstructure analysis revealed that the RA became elongated in the tension direction as the bending temperatures increased.
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Influence of indium addition on characteristics of Sn-0.3Ag-0.7Cu solder alloy
(2009-10-19)
Kanlayasiri, Kannachai
;
Mongkolwongrojn, Mongkol
;
Ariga, Tadashi
Effects of indium (In) addition on solidus and liquidus temperatures, wetting time, wetting force, tensile strength, and microhardness of Sn-0.3Ag-0.7Cu lead-free solder alloy were investigated in this paper. Indium was added and varied from 0 to 3 wt%. It is found that solidus and liquidus temperatures of the solder alloy are lowered as the In content is increased. However, In also increases the melting range between solidus and liquidus temperatures. Wetting time of the solder alloy is reduced by the addition of In while the wetting force is increased with the increase of In content. With the addition of In, the Sn-rich phase is smaller in size, and the intermetallic compounds are more uniformly distributed. As a result, tensile strength and microhardness of Sn-0.3Ag-0.7Cu are increased when In is added into the solder alloy. © 2009 Elsevier B.V. All rights reserved.
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Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders
(2022-04-01)
KANLAYASIRI, Kannachai
;
MOOKAM, Niwat
The effect of Cu content on the microstructure, grain orientation and mechanical properties of Sn–xCu (x=0–4.0 wt.%) lead-free solder was studied. Results showed that added Cu induced the formation of intermetallic phases. Only the η-Cu<inf>6</inf>Sn<inf>5</inf> and ɛ-Cu<inf>3</inf>Sn phases were present in the β-Sn matrix. For all contents, the strongly preferred orientation of the β-Sn phase was formed on the {001} plane. In Sn doped with 1.0 wt.% Cu, the η-Cu<inf>6</inf>Sn<inf>5</inf> phase exhibited the preferred orientation of {0001} plane, whereas doping with 3.0 or 4.0 wt.% Cu transformed the preferred orientation to the {010} plane. In addition, only the {0001} and planes were present in the ɛ-Cu<inf>3</inf>Sn phase. The high Cu contents contributed to an increased number of low-angle boundaries, high residual strain, tensile strength and microhardness.
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Effects of side flushing and multi-aperture inner flushing on characteristics of electrical discharge machining macro deep holes
(2021-01-01)
Chuvaree, Suppawat
;
Kanlayasiri, Kannachai
This research investigates the effect of machining parameters on material removal rate, electrode wear ratio, and gap clearance of macro deep holes with a depth-to-diameter ratio over four. The experiments were carried out using electrical discharge machining with side flushing and multi-aperture flushing to improve the machining performance and surface integrity. The machining parameters were pulse on-time, pulse off-time, current, and electrode rotation. Response surface methodology and the desirability function were used to optimize the electrical discharge machining parameters. The results showed that pulse on-time, current, and electrode rotation were positively correlated with the material removal rate. The electrode wear ratio was inversely correlated with pulse on-time and electrode rotation but positively correlated with current. Gap clearance was positively correlated with pulse on-time but inversely correlated with pulse off-time, current, and electrode rotation. The optimal machining condition of electrical discharge machining with side flushing was 100 µs pulse on-time, 20 µs pulse off-time, 15 A current, and 70 rpm electrode rotation; and that of electrical discharge machining with multi-aperture flushing was 130 µs, 2 µs, 15 A, and 70 rpm. The novelty of this research lies in the use of multi-aperture flushing to improve the machining performance, enable a more uniform GC profile, and minimize the incidence of recast layer.
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Brazing of curved copper sheets using CuNiSnP amorphous filler metal
(2019-09-30)
Jattakul, Prajak
;
Kanlayasiri, Kannachai
This research investigates the effect of bending stress using furnace brazing on the interfacial layer between curved copper sheets and CuNiSnP amorphous filler metal. Copper sheet curvatures were varied between 5, 10, 15, 20, and ∞ mm to manipulate the bending stress of the base metal. The thermal behaviors and phase transformations of CuNiSnP amorphous filler metal were also characterized. The results showed that crystallization of the filler metal started at 200 °C, with multiple phases formed over the course of thermal treatment. The curved radius and bending stress were inversely correlated, while the interfacial layer of brazed joints and copper sheet curvatures were positively correlated. The interfacial layer was thin in small curvature specimens and thick in large radius specimens, indicating that the bending stress in the base metal affected the reliability of brazed joints.
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Simultaneous optimization of dimensional accuracy and surface roughness for finishing cut of wire-EDMed K460 tool steel
(2013-07-01)
Kanlayasiri, Kannachai
;
Jattakul, Prajak
The aim of this research was to determine an optimal cutting condition of dimensional accuracy and surface roughness for finishing cut of wire-EDMed K460 tool steel. The cutting variables investigated in this study encompassed cutting speed, peak current, and offset distance. Box-Behnken design was employed as the experimental strategy, and multiple response optimization on dimensional accuracy and surface roughness was performed using the desirability function. Results showed that both peak current and offset distance have a significant effect on the dimension of the specimen while peak current alone affects the surface roughness. The optimal cutting condition was at 2 A peak current and 772 μm offset distance. Since neither dimension nor surface roughness was affected by cutting speed, the speed was thus set at the highest of 5.5 mm/min to maximize the production rate. Confirmation tests on the optimal cutting condition were executed by which all cut specimens were shown to be within the specifications. © 2013 Elsevier Inc.

Kanlayasiri, Kannachai

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