Somdock, Nuttakrit
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Item type:Publication, Advanced AlN/SiO2/AlN multilayer coatings for protecting gold-like decorative surfaces: Improved hardness and color stability(2025-12-01) ;Raengroeng, Sitanan ;Theekhasuk, Nattharika; ; This study explores the development of multilayer AlN/SiO<inf>2</inf>/AlN thin film coatings to enhance tarnish resistance, surface hardness, and color stability of gold-coated silver substrates for decorative use. Gold films were deposited via electroplating, followed by multilayer coatings using reactive magnetron sputtering. The SiO<inf>2</inf> thickness was systematically varied while maintaining fixed AlN layers. Optical evaluations using CIE Lab parameters confirmed that the specimen with a 110-min SiO<inf>2</inf> layer exhibited acceptable color difference (ΔE < 5). X-ray photoelectron spectroscopy (XPS) revealed stable Al–N and Si–O bonds with minimal oxidation. Nanoindentation tests showed a significant hardness increase, reaching 7.02 ± 0.62 GPa. After 240 days of ambient exposure, multilayer-coated samples showed no visible discoloration or sulfur-induced degradation, unlike uncoated and electrochemically coated samples. These results confirm that AlN/SiO<inf>2</inf>/AlN multilayers effectively improve the durability and aesthetic stability of gold-like surfaces, offering a promising solution for long-term decorative applications. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Nitrate Removal Enhancement Using Pulse Electrolysis and Aluminum Electrode(2025-01-01) ;Suwannimit, Prapavit; ; ; Srirach, PisanThis work focuses on nitrate elimination from municipal wastewater by an electrochemical method with pulsed DC electrolysis. The performance of electroreduction of nitrate was investigated without alkaline electrolyte addition. The nitrate removal reactor was fabricated from acrylic and aluminum electrodes. The nitrate concentration was analyzed by the light absorption of the substance using UV-Vis spectroscopy. The precipitated compounds were determined by X-ray diffraction technique. The experimental results with 180 min treatment indicated the optimum condition for nitrate removal, which was carried out on the pulse frequency of 10 kHz, pulse width of 80%, and electric current density of 16 mA/cm<sup>2</sup>. This condition was able to eradicate nitrate up to 90.73% (4.3 mg/L) from an initial nitrate concentration of 46.0 mg/L with a nitrogen selectivity of 80.08%. Furthermore, the weight loss of aluminum anodes was as low as 0.8%. The main precipitation formed in the electrolyte cell was aluminum hydroxide. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Effects of Red and Blue LEDs Light on Growth and Development of Chrysanthemum Callus(2025-07-01) ;Boonprasop, Sorawit ;Seatiew, Kanjana; ; Effects of LED illumination on callus induction from petals of Karaked and Scarlet chrysanthemums cultivated in MS medium supplemented with 2 mg/I NAA and 4 mg/l Kinetin, under white LED light (PPFD 30±2 µmol/m2/s) and red to blue light in the ratios 30:10, 40:15, and 30:3 (PPFD 50±2 µmol/m2/s) for 16 h. It was determined that a light ratio throughout 4 weeks culture period had no impact on the fresh weight of callus. Conversely, varying light proportions yield distinct callus dry weights. Upon evaluating cultivar parameters, it was determined that ‘Karaked’ exhibited more fresh and dry weight compared to the callus of the ‘Scarlet’. Analysis of Karaked’s callus showed that callus cultured under 30:3 red to blue LED light exhibited the largest concentrations of all photosynthetic pigments, the greatest levels of malondialdehyde (MDA) and total phenolic compounds, and the lowest EC<inf>50</inf> value for DPPH free radical inhibition. In the case of the Scarlet chrysanthemum, following 8 weeks of callus induction, it was observed that a light ratio of red to blue at 40:15 yielded the maximum concentrations of chlorophyll a and carotenoids. No statistical difference was seen in the quantity of chlorophyll b. The MDA content of Scarlet’s callus cultivated under white LED light was the highest, and the EC<inf>50</inf> value for DPPH free radical inhibition was also the highest. Callus produced under red to blue LED light ratios of 30:10, 40:15, and 30:3 exhibited greater quantities of phenolic compared to callus cultured under white LED light. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Sputter-deposited AlN coatings for enhanced tarnish resistance and mechanical durability of silver jewelry(2026-04-01) ;Sudsawad, Kanyarat; ; ; Silver jewelry is prone to surface tarnishing caused by sulfur-containing species in ambient environments. In this study, a transparent aluminum nitride–based thin film was deposited by magnetron sputtering and evaluated as a protective barrier against silver tarnishing. Sheets of 99.9% pure silver were coated under various nitrogen flow conditions to optimize film composition and performance. An appropriate nitrogen flow rate of 25 standard cubic centimeters per minute (sccm), corresponding to an N₂/Ar gas ratio of approximately 1:1, was identified for forming AlN-rich films, while an AlN-based film thickness in the range of 80–110 nm was found to be suitable for jewelry protection. X-ray photoelectron spectroscopy analysis showed that insufficient nitrogen availability suppresses complete nitridation, resulting in residual metallic aluminum, which readily reacts with residual oxygen and moisture, increasing the oxygen content in the films. At an N₂ flow rate of 25 sccm, metallic aluminum was suppressed and the films were dominated by Al–N bonding with minor oxygen incorporation, accompanied by the development of a polycrystalline structure. Nanoindentation measurements performed on the 110 nm-thick film yielded a peak hardness of approximately 3.6 GPa, indicating enhanced mechanical durability compared with uncoated silver. Comparative evaluation of color difference, mechanical hardness, tarnish resistance, and environmental durability demonstrated improved performance of the AlN-coated silver. Finally, the practical applicability of the coating was demonstrated by depositing AlN-based films onto large and intricately designed silver jewelry items, indicating compatibility with industrial-scale processing. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Post-ball-milling-assisted solid-state synthesis of Bi4O4SeCl2: A low thermal conductivity material(2025-02-01) ;Theekhasuk, Nattharika; ;Voraud, Athorn ;Ounrit, IyaratThis study investigates the synthesis of Bi<inf>4</inf>O<inf>4</inf>SeCl<inf>2</inf> through a cost-effective ball-milling-assisted solid-state reaction method. The as-grown samples predominantly consisted of the Bi<inf>12</inf>O<inf>15</inf>Cl<inf>6</inf> phase, with minor contributions from BiOCl and Bi<inf>4</inf>O<inf>4</inf>SeCl<inf>2</inf>. A systematic post-ball-milling process was applied to enhance the formation of the Bi<inf>4</inf>O<inf>4</inf>SeCl<inf>2</inf> phase. Prolonged milling time led to the progressive dominance of the Bi<inf>4</inf>O<inf>4</inf>SeCl<inf>2</inf> phase, resulting in significant improvements in electrical conductivity and reductions in thermal conductivity. After 30 min of milling, the carrier concentration increased notably from −2.23 × 10<sup>16</sup> cm<sup>−3</sup> (as-grown) to −1.01 × 10<sup>18</sup> cm<sup>−3</sup>, while electrical conductivity rose from 0.14 S/cm (as-grown) to 2.26 S/cm. Simultaneously, thermal conductivity decreased from 0.65 W m<sup>−1</sup> K<sup>−1</sup> (as-grown) to 0.35 W m<sup>−1</sup> K<sup>−1</sup>. These findings demonstrate that post-ball-milling is a scalable and economical method for synthesizing Bi<inf>4</inf>O<inf>4</inf>SeCl<inf>2</inf> with low thermal conductivity, highlighting its potential as a promising material for thermal barrier coatings and thermoelectric applications. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Enhanced antimony telluride thermoelectric generators: From material synthesis to device applications(2025-12-01) ;Theekhasuk, Nattharika; ;Voraud, Athorn; This study investigates the effect of Bi₄O₄SeCl₂ (BOSC) addition (0–4 wt%) on the thermoelectric performance of p-type Bi₀.₅Sb₁.₅Te₃ synthesized via high-energy ball milling. XRD analysis revealed lattice incorporation at 1 wt% BOSC, while higher concentrations led to phase separation. The 1 wt% BOSC sample exhibited a significantly reduced total thermal conductivity of 0.28 W/m·K, compared to 0.46 W/m·K in the undoped sample, attributed to enhanced phonon scattering. Despite moderate decreases in electrical conductivity and Seebeck coefficient, a peak ZT of 1.02 at 50 °C was achieved—representing a ∼54 % improvement over the undoped material. Furthermore, a prototype thermoelectric module fabricated with BOSC-doped legs produced a power density of 17.6 mW/cm² under a 150 °C temperature gradient. These results demonstrate that BOSC is an effective additive for reducing thermal conductivity and enhancing overall thermoelectric performance, offering potential for energy harvesting applications at moderate temperatures. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Post-annealing effects on (00l) texture, Cl/Se ratio, and electrical and glass-like thermal transport in Bi₄O₄SeCl₂(2026-04-25); ;Theekhasuk, Nattharika ;Voraud, Athorn; Naemchanthara, KittisakchaiBi₄O₄SeCl₂ is a heteroanionic layered material with intrinsically low lattice thermal conductivity and anisotropic charge transport. In this work, the effects of post-annealing temperature on the crystallographic texture, anion chemistry, defect evolution, and transport properties of Bi₄O₄SeCl₂ were systematically investigated. Polycrystalline Bi₄O₄SeCl₂, synthesized by solid-state reaction combined with high-energy ball milling, was post-annealed at 400–700 °C. X-ray diffraction and electron microscopy revealed that post-annealing eliminated the residual BiOCl precursor phase, enhanced the (00 l) preferred orientation, and promoted grain growth up to 600 °C, followed by partial texture degradation at 700 °C due to recrystallization. Energy-dispersive spectroscopy showed progressive Se and Cl volatilization during annealing, leading to an increased Cl/Se ratio. The carrier mobility and electrical conductivity reached maximum values at 600 °C, consistent with improved texture and layered-domain connectivity. Thermal transport remained lattice-dominated and only weakly temperature-dependent. The phonon mean free path, estimated using kinetic theory, was in the sub-nanometer range (∼0.25–0.57 nm), comparable to the interatomic spacing, indicating glass-like phonon transport. Representative HRTEM observations also revealed dislocation-related lattice defects and locally distorted regions, suggesting that vacancy disorder and local strain fields may provide additional phonon scattering. These results demonstrate that post-annealing optimizes electrical transport through phase purification, texture development, and defect-mediated carrier regulation, while the lattice thermal conductivity remains fundamentally limited by intrinsic glass-like phonon transport in Bi₄O₄SeCl₂. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Synthesis of Fe–Cu Alloys via Ball Milling for Electrode Fabrication Used in Electrochemical Nitrate Removal from Wastewater(2025-07-01) ;Hayeedah, Hannanatullgharah; ; ; Srirach, PisanFe and Cu powders were mixed at a 50:50 ratio. Then, Fe-Cu alloys were prepared using the ball milling technique with different milling times of 6, 12, 18, 24, 30, 36, and 42 h. The crystalline structure was analyzed using X-ray diffraction (XRD), and it was found that the optimum milling time was 30 h. The homogeneity of the Fe and Cu elements in the Fe–Cu alloys was analyzed using the scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM–EDX) mapping technique. Additionally, the crystal orientation of the Fe–Cu alloys was investigated using transmission electron microscopy (TEM). To fabricate the cathode for nitrate removal via electrolysis, an Fe–Cu alloy milled for 30 h was deposited onto a copper substrate using mechanical milling, then annealed at 800 °C. A pulsed DC electrolysis method was developed to test the nitrate removal efficiency of the Fe–Cu-coated cathode. The anode used was an Al sheet. The synthesized wastewater was prepared from KNO<inf>3</inf>. Nitrate removal experiments from the synthesized wastewater were performed for durations of 0–4 h. The results show that the nitrate removal efficiency at 4 h was 96.90% compared to 74.40% with the Cu cathode. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Ultrathin AlN barrier coatings for enhancing surface chemical stability and suppressing electrochemical migration in immersion silver–finished printed circuit boards(2026-08-15) ;Kaewbuadee, Woraprach ;Theekhasuk, Nattharika ;Khumtong, Thanakorn; Immersion silver-finished printed circuit boards (PCB-ImAg) provide low contact resistance and excellent solderability, but their chemical instability in humid and sulfur-containing environments can compromise long-term reliability. In this study, ultrathin aluminum nitride (AlN) films (20–60 nm) were deposited on PCB-ImAg substrates by reactive DC magnetron sputtering as inorganic barrier layers. Their protective performance was evaluated by accelerated H<inf>2</inf>S exposure, long-term ambient air exposure, tape testing, electrical resistance measurements, electrochemical migration (ECM) testing under a 3 V bias at 30 °C and 80% RH, and surface characterization. Uncoated PCB-ImAg samples showed severe tarnishing, Ag<inf>2</inf>S formation, dendritic corrosion, and a marked increase in electrical resistance after both H<inf>2</inf>S and prolonged air exposure. In contrast, AlN-coated samples retained a cleaner surface, remained adherent after the tape test, and showed much smaller resistance changes. X-ray photoelectron spectroscopy detected sulfur-related chemical states only on the uncoated surfaces, indicating suppression of sulfide formation by the AlN layer. A 20 nm AlN coating was sufficient for anti-tarnish and ambient air stability, whereas coatings of 40 nm or greater were required for robust ECM suppression. These results demonstrate that ultrathin AlN films effectively improve the corrosion resistance and ECM reliability of PCB-ImAg surfaces.
