Tunthawiroon, Phacharaphon
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Tunthawiroon, Phacharaphon
Alternative Name
TUNTHAWIROON, Phacharaphon
Tunthawiroon, P.
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Email
phacharaphon.tu@kmitl.ac.th
5 results
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Item type:Publication, Effect of Si on Microstructure and Corrosion Behavior of CoCrMo Alloys(2018-06-04); ; The aim of this research was to investigate the effect of silicon (Si) on the microstructure and corrosion behavior of CoCrMo alloys. The concentration of Si added in CoCrMo alloys was 0.1, 0.5 and 1 wt %. The corrosion behavior of the present alloys was investigated using potentiodynamic polarization measurements. The normal saline solution with 0.9 wt % was used as an electrolyte. Polarization curves obtained from the polarization test were used to evaluate in terms of corrosion current density (i<inf>corr</inf> ), corrosion potential (E<inf>corr</inf> ) and corrosion parameters that be used to compute corrosion resistant property of CoCrMo alloys. The microstructure of a sample during the polarization test was compared using X-ray diffraction (XRD) and optical microscope (OM). The results indicated that the increase in Si slightly changed the microstructure of CoCrMo alloys and could enhance the resistance to corrosion of CoCrMo alloys in NaCl solution. In addition, the reduction of Cr and Mo concentration in CoCrMo alloys was found to be a significant influence on the decrease in corrosion resistance. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Characterization of intermetallic phase in as-cast Si-doped Co-Cr-Mo alloys(2019-10-28); Chiba, A.This research aims to investigate the effects of Si concentrations on the microstructure and formation of the intermetallic phase of Co-Cr-Mo-xSi alloys. The Si concentration (x) was varied between 0.1, 0.5, 1.0, 3.0 and 5.0 wt%. The microstructure and intermetallic phase of the solution heat-treated Co-Cr-Mo alloys were characterized using SEM-EDX, XRD and TEM. The microstructure analysis revealed that Si concentration played a role in the evolution of intermetallic phase precipitating in Co-Cr-Mo alloys. Two types of intermetallic phased were found in the Si-doped Co-Cr-Mo alloys. The σ phase was identified in the alloys containing Si between 0.1-1.0 wt% while the increase in Si (3.0-5.0Si) contributed to the formation of the χ phase. The calculated lattice parameters of the intermetallic phase precipitated in the 3.0Si and 5.0Si alloys correlated well with those of Co<inf>5</inf>Cr<inf>3</inf>Si<inf>2</inf> phase. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Effects of Si concentrations on microstructure and mechanical properties of as-cast Co-Cr-Mo alloys(2019-10-28); Chiba, A.This research investigates the effects of different Si concentrations on the microstructure and mechanical properties of Co-Cr-Mo-xSi alloys. The Si concentration (x) was 0.1, 0.5, 1.0, 3.0 and 5.0 wt%. The mechanical properties of the experimental heat-treated Co-Cr-Mo-xSi alloys was determined by hardness and tensile tests. The microstructure was analyzed using SEM. The microstructure analysis revealed that Si concentration played a role in the formation of the intermetallic phase of Co-Cr-Mo-xSi alloys. The presence of the intermetallic phase significantly decreased the ductility of the experimental alloys. However, the hardness was improved and was increased directly proportional to the fraction of the intermetallic phase precipitating in the Co-Cr-Mo-xSi alloys. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate(2019-08-01); The effects of Ag on the microstructure and corrosion behavior of pre-soldering Sn–xAg lead-free solders, and on the formation of intermetallic layer of the solders with Cu substrate were investigated. The Ag contents (x) were 0, 3.0, 3.5, 4.0, and 5.0 wt.%. The Ag content played a role in the morphology of Ag<inf>3</inf>Sn phase in the solders. The microstructure analysis showed that the β-Sn phase was surrounded by eutectic networks in the 3.0Ag and 3.5Ag solders and large plate-like Ag<inf>3</inf>Sn formed in the 4.0Ag and 5.0Ag solders. Nonetheless, the Ag content slightly impacted the corrosion behavior of the as-cast solders as characterized using potentiodynamic polarization test. After soldering, only a single layer of a Cu<inf>6</inf>Sn<inf>5</inf> intermetallic compound formed at the Sn–xAg/Cu interface. By comparison, the Cu<inf>6</inf>Sn<inf>5</inf> intermetallic layer of the Ag-doped solders was thinner than that of the 0Ag solder. The fine Ag<inf>3</inf>Sn particles in the eutectic networks precipitating in the 3.0Ag and 3.5Ag solders effectively hindered the growth of Cu<inf>6</inf>Sn<inf>5</inf> grains compared to large plate-like Ag<inf>3</inf>Sn in the 4.0 and 5.0Ag solders. - Some of the metrics are blocked by yourconsent settings
Item type:Publication, Effects of copper content in Sn-based solder on the intermetallic phase formation and growth during soldering(2018-06-04); This research has studied the effects of copper contents in the Sn-based solder (i.e. Sn-0.7Cu, Sn-1.0Cu, and Sn-3.0Cu) on the intermetallic phase formation and the growth during soldering. In the experiments, reflow soldering was performed at 350 °C with the Cu substrate by using three solders for various soldering times of 10, 20, 40, 60, 120, 240 and 480 s. XRD data have shown that the η-Cu<inf>6</inf>Sn<inf>5</inf> and ϵ-Cu<inf>3</inf>Sn phases with hexagonal crystal structure were present between the solder and the substrate. The presence of ϵ-Cu<inf>3</inf>Sn phase was found only when the substrate was soldered for at least 240 s. The Cu content in solder had significant effects on the intermetallic growth with long term soldering time. In addition, the diffusion coefficient was correlated to the Cu content in the solder.