Loading...
Study of silicon thermopile
Author(s)
Date Issued
December 1, 2000
Type
Conference Paper
Abstract
This research paper introduces a silicon thermopile sensor, which shows higher Seebeck coefficient than a metal thermopile sensor. The vacuum evaporation technique was used to fabricate this silicon-based thermopile with Titanium as parts of the sensor. By using the concept that different of temperature between junctions would induce voltage that corresponse to the temperature different and materials used for the device. This work starting from design, fabricate, and test the device. At the ends of this work, we successfully fabricated the sensor and tested. The results show that the sensor demonstrate higher Seebeck coefficient than the one from metal-base thermopile sensor. For the future work, the different materials will be used to fabricate the thermopile sensor and compared to the Seebeck coefficient of the one from silicon.
Citation
IEEE Region 10 Annual International Conference Proceedings TENCON, 3, I-226-I-229, 2000