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Thermal simulation of microwave kiln based on multiphysics

Author(s)
Jansaengsuk, Thodsaphon
Pattanapichai, Sorathon
Poopanya, Piyawong
Phimphakan, Nonthawat
Thongsri, Jatuporn
Date Issued
January 1, 2023
Type
Conference Paper
DOI
10.1109/ITC-CSCC58803.2023.10212790
Abstract
A microwave kiln, made of silicon carbide and ceramic fiber, commonly employs in a household glassware production process. In this process, when the kiln was in a microwave oven, a microwave transmitted to the kiln generating a high temperature to fuse the glass inside. This article presents a thermal simulation to investigate the temperature inside the kiln based on multiphysics consisting of a high-frequency structure simulator (HFSS) and computational fluid dynamics (CFD). The multiphysics results revealed the temperature inside the kiln in a transient state, consistent with the experimental results. As expected, the temperature increased with the increasing time of the process. Significantly, the silicon carbide had higher temperatures than the ceramic fiber; therefore, silicon carbide is a crucial material for generating heat inside the kiln. In addition, the temperature-increasing rate (TIR) inside the kiln depended on the kiln's thickness (Th). As a result, the thinner Th provided better TIR. The research findings can be applied to develop a high-efficacy household glassware production process.
Citation
2023 International Technical Conference on Circuits Systems Computers and Communications Itc Cscc 2023, 2023
Subjects

ANSYS

computer simulation

glassware production

HFSS

kiln

microwave oven

multiphysics

thermal simulation

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