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EFFECT OF DIPPING SOLDERING ON THICKNESS AND INTERMETALLIC COMPOUND MORPHOLOGY BETWEEN Sn-3.0Cu LEAD-FREE SOLDER AND COPPER SUBSTRATE
Author(s)
Mookam, Niwat
Date Issued
January 1, 2022
Type
Article
Abstract
The thickness and morphology of intermetallic compounds formed between Sn-3.0Cu lead-free solder and the copper substrate were investigated. In the experiment, the dipping soldering was performed at 350°C using Sn-3.0Cu lead-free solder for various dipping time lengths of 5, 10, 20, 50, 75 and 100s, respectively. The results indicated that η- Cu6Sn5 intermetallic phase was found to exist between the lead-free solder and the copper substrate. The formation of an ε-Cu3Sn particles on the η- Cu6Sn5 surface and grain boundary was found only when the substrate was soldered for 75 and 100s. The long soldering time and formation of ε-Cu3Sn particles resulted in the morphology of the η- Cu6Sn5 IMC changed from scallop shape to more round. Nevertheless, the thickness and morphology of intermetallic compounds was also found to be influenced by the diffusion controlled process.
Citation
Suranaree Journal of Science and Technology, 29(2), 2022