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Physical properties of copper films deposited by compact-size magnetron sputtering source with changing magnetic field strength
Author(s)
Sittimart, Phongsaphak
Patanoo, Nattatip
Kongnithichalerm, Sukrit
Horprathum, Mati
Bhathumnavin, Worawan
Paosawatyanyong, Boonchoat
Date Issued
January 1, 2016
Type
Conference Paper
Abstract
An affordable 6-cm diameter magnetron-sputtering source was designed and constructed using a neodymium cylindrical permanent magnet inner stud and an outer ring magnet. Both magnets were set in isolation from a water-cooled disk behind the target. In this work, our magnetron sputtering source was employed to deposit copper thin films by changing the outer magnet ring. The outer magnet ring diameter sizes were 29 mm (I.D.)/39 mm (O.D.) and 30 mm (I.D.)/50 mm (O.D.). At the same applied bias voltage, the discharge current of the magnetron with a large outer magnet was higher than that of one with a small outer magnet. According to the XRD pattern and AFM image of copper films, the degree of (111) and (200) orientations and the surface roughness were increased in the case of films grown by magnetron with a larger outer magnet. The cross-sectional and planeview SEM images showed that grain size and film thickness were increased in cases of films grown by magnetron with a larger outer magnet. These results are likely due to the radial motion of secondary electron emitted from sputtering in front of the target surface being increased with a larger magnet.
Citation
Key Engineering Materials, 675-676, 193-196, 2016