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Low cost hot embossing process for plastics microfluidic chips fabrication

Author(s)
Lomas, T.
Mongpraneet, S.
Wisitsoraat, A.
Jaruwongrungsee, K.
Sappat, A.
Maturos, T.
Chevasuvit, F.
Tuantranont, Adisorn
Date Issued
October 22, 2009
Type
Conference Paper
DOI
10.1109/ECTICON.2009.5137048
Abstract
In this work, we develop plastic microfluidic chips based on low cost hot embossing process with metal micromold. Metal micromold was formed on aluminum substrates by CNC milling machine and high precision micromachine. The hot embossing system is in-house made with computer aid design by Solid Work program. The system consists of four main parts, structural body, heating system, compressive system and control electronics. The compressive system consists of two top hydraulic single-stage pistons and four middle-stage pistons. Polymethyl methacrylate (PMMA) microfluidic chips were then produced by hot embossing under different applied temperatures and time. It was found that optimum temperature and time for minimum contraction and depth error were 80 degree C and 2-5 minutes. The developed technique offer advantages for microfluidic chip fabrication in term of quality, complexity and cost. ©2009 IEEE.
Citation
2009 6th International Conference on Electrical Engineering Electronics Computer Telecommunications and Information Technology Ecti Con 2009, 1, 462-464, 2009
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