Repository logo
Communities & Collections
Research Outputs
Fundings & Projects
People
Statistics
New user? Click here to register.Have you forgotten your password?
  1. Home
  2. KMITL
  3. Publication
  4. Property Improvement of Biodegradable High-Methoxy Pectin Film by Different Contents of Dialdehyde Starch
Loading...
Thumbnail Image

Property Improvement of Biodegradable High-Methoxy Pectin Film by Different Contents of Dialdehyde Starch

Author(s)
Prachayawarakorn, Jutarat
Poomkaew, Sasikorn
Date Issued
August 1, 2020
Type
Article
DOI
10.1007/s10924-020-01767-y
Abstract
In order to improve high hydrophilicity and low mechanical properties of biodegradable high-methoxy pectin (HMP) film, dialdehyde starch (DS) were introduced. In this study, different HMP/DS blended films were prepared by varying DS contents. It was observed from Infrared spectra that lower peak intensity of C=O stretching was detected after the incorporation of DS into HPM film. Moreover, moisture uptake of various HMP/DS blended films was found to be significantly lower than those of HMP film with the addition of low DS content. The improvement of mechanical properties was observed in various HPM/DS blended films. In addition, color parameters, swelling power, morphological and biodegradable properties of various HMP/DS blended films were also investigated.
Citation
Journal of Polymers and the Environment, 28(8), 2227-2235, 2020
Subjects

Biodegradable film

Pectin

Starch

Metrics
Get Involved!
  • Source Code
  • Documentation
  • Slack Channel
Make it your own

DSpace-CRIS can be extensively configured to meet your needs. Decide which information need to be collected and available with fine-grained security. Start updating the theme to match your Institution's web identity.

Need professional help?

The original creators of DSpace-CRIS at 4Science can take your project to the next level, get in touch!

Built with DSpace-CRIS software - Extension maintained and optimized by 4Science

  • Accessibility settings
  • Privacy policy
  • End User Agreement
  • Send Feedback