Antifungal copper nanocomposite-rubber compound for tree wound dressings

Abstract

This study combines copper nanoparticles (CuNPs) with a rubber compound to develop a tree wound dressing that reduces tree mortality from infections, utilizing broad-spectrum antifungal and adhesive properties of composite material. Phytotoxicities of CuNPs with an average size of 6 nm were significantly lower than those of Cu ions, evaluated by the germination index using lettuce seeds and membrane integrity index using stems of rubber seedling. After that, the synthesized CuNPs were then loaded into a natural rubber (NR) latex compound at concentrations ranging from 0 to 90 mg/L to produce a CuNP composite adhesive. The shear strength, representing adhesion on wood, was evaluated using lap shear testing, revealing a 50 % reduction in maximum force at the highest CuNP loading. This loss of shear strength was attributed to interference by copper ions in the vulcanization of the NR latex compound, as indicated by FT-IR spectroscopy. After that, the CuNP composite adhesive was formed into a film to test antifungal properties against Colletotrichum spp. Based on the in vitro plate inhibition zone assay, 10 mg/L of CuNPs inhibited the growth of Colletotrichum spp. The size of inhibited zone was significantly increased by 150 and 300 % when concentrations of CuNPs were 70 and 90 mg/L, respectively. This research provides the first evidence of the low phytotoxicity of CuNPs compared to copper ions at equivalent concentrations and demonstrates the efficacy of CuNP composites with NR compounds as tree wound dressings.