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Effect of soldering condition on formation of intermetallic phases developed between Sn-0.3Ag-0.7Cu low-silver lead-free solder and Cu substrate
Author(s)
Mookam, Niwat
Date Issued
May 26, 2011
Type
Article
Abstract
In this paper, effect of soldering time and temperature on formation of intermetallic compounds developed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate was investigated. Dip soldering was performed at 250, 270, and 290 °C with soldering time of 5, 10, 15, and 20 s. Either ε-Cu 3Sn or η-Cu6Sn5 intermetallic phase was found at the interface between the solder and the substrate depending on the soldering condition, i.e., soldering time and soldering temperature. ε-Cu3Sn was found only when the substrate was soldered at 250 °C for 5 and 10 s. At other soldering conditions, only η-Cu 6Sn5 was found at the interfacial zone. Crystal structure of ε-Cu3Sn intermetallic phase was orthorhombic, and it was hexagonal structure for η-Cu6Sn5. Transformation of the intermetallic phases was also discussed. © 2011 Elsevier B.V. All rights reserved.
Citation
Journal of Alloys and Compounds, 509(21), 6276-6279, 2011