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Coupled Electromagnetic-Thermal Multiphysics Analysis and Design Optimization of a Microwave Kiln

Author(s)
Samakkarn, Chawit
Poopanya, Piyawong
Thongsri, Jatuporn
Date Issued
May 1, 2026
Type
Article
DOI
10.3390/app16104722
Abstract
This study presents a multiphysics investigation of a microwave kiln for the glass-casting process, focusing on the coupled interaction between electromagnetic heating and thermal responses. The kiln (SiC-based) was experimentally tested in a household 800 W, 2450 MHz microwave oven without rotation for 5 min, with temperatures recorded at key positions using thermocouples and verified by thermal imaging. The computational framework integrates ANSYS (2021R1) High-Frequency Structure Simulator (HFSS) for electromagnetic-field and heat-generation prediction with Transient Thermal Analysis (TTA) for time-dependent temperature distribution. Validation showed agreement between simulation and experiment of the final temperature, with most errors below 4%, confirming the model’s reliability. A parametric study revealed that a thin SiC susceptor layer (1.5–2.0 mm) improves heat generation and temperature uniformity, while excessive thickness reduces heating efficiency. The optimized design improved the temperature by 2.58% compared with the original configuration at 800 W and achieved up to 38.44% improvement under specific operating conditions. These findings demonstrate that the proposed multiphysics method can support future development of small-scale glass-casting systems and sustainable recycled-glass production. Consequently, the work paves the way to Sustainable Development Goals (SDGs).
Citation
Applied Sciences Switzerland, 16(10), 2026
Subjects

high-frequency struct...

microwave kiln

multiphysics

sustainable developme...

transient thermal ana...

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