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The investigation of thermal effect on dynamical shape changing of solder paste by using double-view digital holography
Author(s)
Date Issued
January 1, 2015
Type
Conference Paper
Abstract
In this paper we propose a modern technique to evaluate the shape changes of solder paste by using double-view in-line digital holography. We observed the transformation of three different kinds of solder paste composition: pure solder paste, solder paste mixed with 0.02%, 0.05%, 0.10% graphene (GPN) and 0.02%, 0.05%, 0.10% graphene oxide (GPNO), respectively. The shape of the solder pastes was investigated at different melt temperatures (i.e. 200°C, 250°C, and 300°C) for 30 seconds using a collimated beam propagating through the solder paste, then being double reflected on a mirror and second incident on another sides of the solder paste. The double images bearing beams were recorded with a CCD sensor simultaneously. The single recorded digital hologram from double view technique was reconstructed using digital holography. The results show that the double-view technique provides reliably data. Moreover, it would be developed for observing more than two images by single holography writing in the future.
Citation
Proceedings of SPIE the International Society for Optical Engineering, 9659, 2015