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Optimizing Product Quality Prediction in Smart Manufacturing Through Parameter Transfer Learning: A Case Study in Hard Disk Drive Manufacturing
Author(s)
Date Issued
April 1, 2025
Type
Article
Abstract
In recent years, the semiconductor industry has embraced advanced artificial intelligence (AI) techniques to facilitate intelligent manufacturing throughout their organizations, with particular emphasis on virtual metrology (VM) systems. Nonetheless, the practical application of data-driven virtual metrology for product quality inspection encounters notable hurdles, such as annotating inspections in highly dynamic industrial environments. This leads to complexities and significant expenses in data acquisition and VM model training. To address the challenges, we delved into transfer learning (TL). TL offers a valuable avenue for knowledge sharing and scaling AI models across various processes and factories. At the same time, research on transfer learning in VM systems remains limited. We propose a novel parameter transfer learning (PTL) architecture for VM systems and examine its application in industrial process automation. We implemented cross-factory and cross-recipe transfer learning to enhance VM performance and offer practical advice on adapting TL to meet individual needs and use cases. By leveraging extensive data from Seagate wafer factories, known for their large-scale and high-dimensional nature, we achieved significant PTL performance improvements across multiple performance metrics, with the true positive rate (TPR) increasing by 29% and false positive rate (FPR) decreasing by 43% in the cross-factory study. In contrast, in the cross-recipe study, TPR increased by 27.3% and FPR decreased by 6.5%. With our proposed PTL architecture and its performance achievements, insufficient data from the new manufacturing sites, new production lines and new products are addressed with shorter VM model training time and smaller computational power with strong final quality prediction confidence.
Citation
Processes, 13(4), 2025