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Capacitance-voltage (c-v) characteristic effect of pt atom power device

Author(s)
Sangwaranatee, Narong
Srithanachai, Itsara
Yupapin, Preecha P.
Date Issued
June 1, 2016
Type
Article
DOI
10.17654/EC016020443
Abstract
As Pt atoms may create problem into the surface and junction of the power device, the paper investigates the effect of Pt atoms in thermal annealing (TA) process for various temperature environments. Though experiments, the comparison between un-doped and Pt-doped results for 850 °C and 900 °C has been made. As per results obtained Pt atoms can be deeply diffused to the silicon bulk after the TA 2 process. While before this process, the Pt diffusion range was recorded to be 4,500A. It was found that there was no significant change in C-V characteristics of Pt-doped, when the Vbi of 0.4-0.5eV got achieved. Thus, the Pt atoms contact type is not changed and the carrier concentration is confirmed due to effect that Pt may induce trap or cluster that can reduce the power device carrier concentration.
Citation
Far East Journal of Electronics and Communications, 16(2), 443-449, 2016
Subjects

Electronics

Power device

Semiconductor

Thermal annealing

Trap

Metrics
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