Influence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders

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dc.contributor.authorKANLAYASIRI, Kannachai
dc.contributor.authorMOOKAM, Niwat
dc.date.accessioned2026-08-06T10:36:44Z
dc.date.available2026-08-06T10:36:44Z
dc.date.issued2022-04-01
dc.description.abstractThe effect of Cu content on the microstructure, grain orientation and mechanical properties of Sn–xCu (x=0–4.0 wt.%) lead-free solder was studied. Results showed that added Cu induced the formation of intermetallic phases. Only the η-Cu<inf>6</inf>Sn<inf>5</inf> and ɛ-Cu<inf>3</inf>Sn phases were present in the β-Sn matrix. For all contents, the strongly preferred orientation of the β-Sn phase was formed on the {001} plane. In Sn doped with 1.0 wt.% Cu, the η-Cu<inf>6</inf>Sn<inf>5</inf> phase exhibited the preferred orientation of {0001} plane, whereas doping with 3.0 or 4.0 wt.% Cu transformed the preferred orientation to the {010} plane. In addition, only the {0001} and planes were present in the ɛ-Cu<inf>3</inf>Sn phase. The high Cu contents contributed to an increased number of low-angle boundaries, high residual strain, tensile strength and microhardness.
dc.identifier.citationTransactions of Nonferrous Metals Society of China English Edition, 32(4), 1226-1241, 2022
dc.identifier.doi10.1016/S1003-6326(22)65869-2
dc.identifier.issn10036326
dc.identifier.other2-s2.0-85129948765
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/13145
dc.sourceTransactions of Nonferrous Metals Society of China English Edition
dc.subjectcrystallographic orientation
dc.subjectintermetallics
dc.subjectlead-free solder
dc.subjectmechanical properties
dc.subjectmicrostructure
dc.subjectSn–Cu alloys
dc.titleInfluence of Cu content on microstructure, grain orientation and mechanical properties of Sn–xCu lead-free solders
dc.typeArticle

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