Effects of Ag contents in Sn�xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate

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dc.contributor.authorPhacharaphon TUNTHAWIROON
dc.contributor.authorKannachai KANLAYASIRI
dc.date.accessioned2025-07-21T06:02:05Z
dc.date.issued2019-08-01
dc.identifier.doi10.1016/s1003-6326(19)65076-4
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/8632
dc.subject.classificationElectronic Packaging and Soldering Technologies
dc.titleEffects of Ag contents in Sn�xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate
dc.typeArticle

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