A study on wettability and formation of intermetallic phase between Co�Cr�Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages

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dc.contributor.authorTin Tin Kyaw
dc.contributor.authorPhacharaphon Tunthawiroon
dc.contributor.authorKannachai Kanlayasiri
dc.contributor.authorKenta Yamanaka
dc.contributor.authorAkihiko Chiba
dc.date.accessioned2025-07-21T06:03:47Z
dc.date.issued2020-07-04
dc.identifier.doi10.1016/j.intermet.2020.106875
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/9581
dc.subject.classificationElectronic Packaging and Soldering Technologies
dc.titleA study on wettability and formation of intermetallic phase between Co�Cr�Mo alloy and Sn-Solder used as a potential under bump metallization for flip-chip packages
dc.typeArticle

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