Simulation of Copper Thin Film Thickness Optimization for Surface Plasmon using the Finite Element Method

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dc.contributor.authorTanaporn Leelawattananon
dc.contributor.authorKritsakorn Lorchalearnrat
dc.contributor.authorSuphamit Chittayasothorn
dc.date.accessioned2025-07-21T05:57:46Z
dc.date.issued2017-01-01
dc.identifier.doi10.5220/0006395601880195
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/6216
dc.subject.classificationAdvancements in Photolithography Techniques
dc.titleSimulation of Copper Thin Film Thickness Optimization for Surface Plasmon using the Finite Element Method
dc.typeArticle

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