Effects of Annealing Process on the Electrical Properties of MEMS Capacitive Microphone

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dc.contributor.authorJirawat Jantawong
dc.contributor.authorChana Leepattarapongpan
dc.contributor.authorEkalak Chaowicharat
dc.contributor.authorWutthinan Jeamsaksiri
dc.contributor.authorAnu Austin
dc.contributor.authorKathirgamasundaram Sooriakumar
dc.contributor.authorSurasak Niemcharoen
dc.date.accessioned2025-07-21T05:59:39Z
dc.date.issued2018-03-01
dc.identifier.doi10.1109/ieecon.2018.8712180
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/7299
dc.subjectWafer Bonding
dc.subject.classificationAdvanced MEMS and NEMS Technologies
dc.titleEffects of Annealing Process on the Electrical Properties of MEMS Capacitive Microphone
dc.typeArticle

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