Effects of substrate annealing on wettability and intermetallic compound formation in Sn�3.0Cu/Cu systems
| dc.contributor.author | Niwat Mookam | |
| dc.contributor.author | Kannachai Kanlayasiri | |
| dc.date.accessioned | 2025-07-21T06:01:36Z | |
| dc.date.issued | 2019-05-29 | |
| dc.identifier.doi | 10.1007/s10854-019-01566-9 | |
| dc.identifier.uri | https://dspace.kmitl.ac.th/handle/123456789/8377 | |
| dc.subject | Misorientation | |
| dc.subject.classification | Electronic Packaging and Soldering Technologies | |
| dc.title | Effects of substrate annealing on wettability and intermetallic compound formation in Sn�3.0Cu/Cu systems | |
| dc.type | Article |