Fabrication of Contour Cavity Using Multi-Exposure Lithography for MEMS Capacitive Microphone

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dc.contributor.authorJantawong, Jirawat
dc.contributor.authorAtthi, Nithi
dc.contributor.authorLeepattarapongpan, Chana
dc.contributor.authorJeamsaksiri, Wutthinan
dc.contributor.authorAustin, Anu
dc.contributor.authorSooriakumar, Kathirgamasundaram
dc.contributor.authorNiemcharoen, Surasak
dc.date.accessioned2026-08-06T10:20:22Z
dc.date.available2026-08-06T10:20:22Z
dc.date.issued2018-07-02
dc.description.abstractThis paper presents a novel technique to optimize a capacitive pressure sensor with multi-exposure dose lithography. As part of achieving high signal to noise ratio (SNR) in microphone, a new design was implemented. The new design defies the conventional wisdom of parallel plate theory and implement a concept of contour cavity (backplate) to follows the diaphragm deflection. This 3-dimensional contour cavity (CC) is fabricated by multi-exposure dose lithography with single silicon etching process. The CC structure with different etched depth of 0.65, 1.15, and 1.57 micron were fabricated by multi-exposure dose of 92, 120, and 210 mJ/cm<sup>2</sup>on 5.0 micron thick photoresist and single step etching with CF<inf>4</inf>/O<inf>2</inf>plasma (Si/PR etch selectivity: 1.3). Due to this novel contour cavity design, polysilicon membrane with 0.8 micron thick and a diameter of 930 micron structure produces the capacitance value of 2.88 pF, which is 28.6% higher than that of conventional parallel plate capacitive sensor.
dc.identifier.citationIeecon 2018 6th International Electrical Engineering Congress, 2018
dc.identifier.doi10.1109/IEECON.2018.8712286
dc.identifier.other2-s2.0-85066624864
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/8685
dc.sourceIeecon 2018 6th International Electrical Engineering Congress
dc.subject3-D lithography
dc.subjectBox cavity
dc.subjectContour cavity
dc.subjectMembrane
dc.subjectMEMS capacitive microphone
dc.subjectMulti-exposure
dc.subjectSilicon microphone
dc.titleFabrication of Contour Cavity Using Multi-Exposure Lithography for MEMS Capacitive Microphone
dc.typeConference Paper

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