A New Technique for Brazing Porous Copper to Copper Substrate Using CuNiSnP Amorphous Filler Metal

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dc.contributor.authorNiwat Mookam
dc.contributor.authorPrajak Jattakul
dc.contributor.authorTadashi Ariga
dc.contributor.authorKannachai Kanlayasiri
dc.date.accessioned2026-05-08T19:24:44Z
dc.date.issued2025-3-26
dc.identifier.doi10.1007/s11665-025-11086-9
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/19711
dc.publisherJournal of Materials Engineering and Performance
dc.subjectAluminum Alloys Composites Properties
dc.subjectNanoporous metals and alloys
dc.subjectAdditive Manufacturing and 3D Printing Technologies
dc.titleA New Technique for Brazing Porous Copper to Copper Substrate Using CuNiSnP Amorphous Filler Metal
dc.typeArticle

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