Investigation of morphological surface features, wetting behavior and mechanical traits under various substrate temperatures for beta iron disilicide prepared via facing-targets sputtering

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dc.contributor.authorPeerasil Charoenyuenyao
dc.contributor.authorRawiwan Chaleawpong
dc.contributor.authorNattakorn Borwornpornmetee
dc.contributor.authorBoonchoat Paosawatyanyong
dc.contributor.authorPhongsaphak Sittimart
dc.contributor.authorTsuyoshi Yoshitake
dc.contributor.authorNathaporn Promros
dc.date.accessioned2026-05-08T19:19:18Z
dc.date.issued2022-3-30
dc.identifier.doi10.1016/j.mssp.2022.106604
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/16951
dc.publisherMaterials Science in Semiconductor Processing
dc.subjectSemiconductor materials and interfaces
dc.subjectSemiconductor materials and devices
dc.subjectCopper Interconnects and Reliability
dc.titleInvestigation of morphological surface features, wetting behavior and mechanical traits under various substrate temperatures for beta iron disilicide prepared via facing-targets sputtering
dc.typeArticle

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