Multi-Objective Optimization of Mn-Doped Tio<sub>2</sub> Content for Wettability, Printability and Intermetallic Layer of Sac305 Pb-Free Solder Paste on a Cu Substrate
| dc.contributor.author | K. Kanlayasiri | |
| dc.contributor.author | T. Ariga | |
| dc.date.accessioned | 2025-07-21T06:05:00Z | |
| dc.date.issued | 2021-03-29 | |
| dc.identifier.doi | 10.1142/s0219686721500372 | |
| dc.identifier.uri | https://dspace.kmitl.ac.th/handle/123456789/10211 | |
| dc.subject.classification | Electronic Packaging and Soldering Technologies | |
| dc.title | Multi-Objective Optimization of Mn-Doped Tio<sub>2</sub> Content for Wettability, Printability and Intermetallic Layer of Sac305 Pb-Free Solder Paste on a Cu Substrate | |
| dc.type | Article |