Influence of indium addition on characteristics of Sn�0.3Ag�0.7Cu solder alloy

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dc.contributor.authorKannachai Kanlayasiri
dc.contributor.authorMongkol Mongkolwongrojn
dc.contributor.authorTadashi Ariga
dc.date.accessioned2025-07-21T05:50:39Z
dc.date.issued2009-06-12
dc.identifier.doi10.1016/j.jallcom.2009.06.020
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/2171
dc.subjectSolidus
dc.subjectLiquidus
dc.subject.classificationElectronic Packaging and Soldering Technologies
dc.titleInfluence of indium addition on characteristics of Sn�0.3Ag�0.7Cu solder alloy
dc.typeArticle

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