Influence of thermal aging on microhardness and microstructure of Sn�0.3Ag�0.7Cu�xIn lead-free solders

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dc.contributor.authorKannachai Kanlayasiri
dc.contributor.authorTadashi Ariga
dc.date.accessioned2025-07-21T05:51:28Z
dc.date.issued2010-06-17
dc.identifier.doi10.1016/j.jallcom.2010.05.057
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/2610
dc.subjectBrittleness
dc.subject.classificationElectronic Packaging and Soldering Technologies
dc.titleInfluence of thermal aging on microhardness and microstructure of Sn�0.3Ag�0.7Cu�xIn lead-free solders
dc.typeArticle

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