Effect of Exposure Energy, Focus Range, and Surface Reflection on the Photolithography Process of Contact Hole Patterning

Simple item page
dc.contributor.authorR. Sonboonton
dc.contributor.authorE. Chaowicharat
dc.contributor.authorP. Meesapawong
dc.contributor.authorJ. Ladthidej
dc.contributor.authorW. Titiroongruang
dc.contributor.authorC. Hruanun
dc.date.accessioned2025-07-21T05:49:43Z
dc.date.issued2008-05-01
dc.identifier.doi10.1109/ecticon.2008.4600546
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/1607
dc.subjectPhotoresist
dc.subjectChemical Mechanical Planarization
dc.subjectUndercut
dc.subjectMicroelectronics
dc.subject.classificationAdvanced Surface Polishing Techniques
dc.titleEffect of Exposure Energy, Focus Range, and Surface Reflection on the Photolithography Process of Contact Hole Patterning
dc.typeArticle

Files

Collections

All