Effects of in addition on solidus and liquidus temperatures, microhardness, and wettability of Sn-0.3Ag-0.7Cu solder alloy

Simple item page
dc.contributor.authorKannachai Kanlayasiri
dc.date.accessioned2025-07-21T05:50:09Z
dc.date.issued2008-11-01
dc.identifier.doi10.1109/iemt.2008.5507809
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/1887
dc.subjectSolidus
dc.subjectLiquidus
dc.subject.classificationElectronic Packaging and Soldering Technologies
dc.titleEffects of in addition on solidus and liquidus temperatures, microhardness, and wettability of Sn-0.3Ag-0.7Cu solder alloy
dc.typeArticle

Files

Collections

All