Management of air conditioning system in electronics housing by using thermoelectric Peltier module

Abstract

The study was the conditioning system of the electronic case by using thermoelectric Peltier module. The Peltier module is used based on the temperature difference of the hot and cold sides, with input electric power in the thermoelectric Peltier module. The hot side of the Peltier module was installed on a side of the heat sinks with heat removing from a Peltier module into a surrounding while the cold side of the Peltier module was installed on the other side of the heat sinks with the heat absorption of the computer case. The electronic case volume is 450x395x240 mm³. The device of cooling loads was installed in the electronic case. The cooling loads were tested with various power of 0, 60, 120, 180, and 240 Watt. The results indicated that the coefficient of performance (COP) increased with the cooling load. Furthermore, the experimental results indicated that the temperature inside the electronic case increased with cooling load because the temperature of the electronic case increased with decreasing the temperature difference between the hot and the cold sides.