Effects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate

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dc.contributor.authorTUNTHAWIROON, Phacharaphon
dc.contributor.authorKANLAYASIRI, Kannachai
dc.date.accessioned2026-08-06T10:25:29Z
dc.date.available2026-08-06T10:25:29Z
dc.date.issued2019-08-01
dc.description.abstractThe effects of Ag on the microstructure and corrosion behavior of pre-soldering Sn–xAg lead-free solders, and on the formation of intermetallic layer of the solders with Cu substrate were investigated. The Ag contents (x) were 0, 3.0, 3.5, 4.0, and 5.0 wt.%. The Ag content played a role in the morphology of Ag<inf>3</inf>Sn phase in the solders. The microstructure analysis showed that the β-Sn phase was surrounded by eutectic networks in the 3.0Ag and 3.5Ag solders and large plate-like Ag<inf>3</inf>Sn formed in the 4.0Ag and 5.0Ag solders. Nonetheless, the Ag content slightly impacted the corrosion behavior of the as-cast solders as characterized using potentiodynamic polarization test. After soldering, only a single layer of a Cu<inf>6</inf>Sn<inf>5</inf> intermetallic compound formed at the Sn–xAg/Cu interface. By comparison, the Cu<inf>6</inf>Sn<inf>5</inf> intermetallic layer of the Ag-doped solders was thinner than that of the 0Ag solder. The fine Ag<inf>3</inf>Sn particles in the eutectic networks precipitating in the 3.0Ag and 3.5Ag solders effectively hindered the growth of Cu<inf>6</inf>Sn<inf>5</inf> grains compared to large plate-like Ag<inf>3</inf>Sn in the 4.0 and 5.0Ag solders.
dc.identifier.citationTransactions of Nonferrous Metals Society of China English Edition, 29(8), 1696-1704, 2019
dc.identifier.doi10.1016/S1003-6326(19)65076-4
dc.identifier.issn10036326
dc.identifier.other2-s2.0-85072263563
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/10122
dc.sourceTransactions of Nonferrous Metals Society of China English Edition
dc.subjectAg3Sn intermetallic phase
dc.subjectcorrosion behavior
dc.subjectCu6Sn5 intermetallic layer
dc.subjectmicrostructure
dc.subjectSn–Ag lead-free solders
dc.subjectwettability
dc.titleEffects of Ag contents in Sn–xAg lead-free solders on microstructure, corrosion behavior and interfacial reaction with Cu substrate
dc.typeArticle

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