Coupling Minimization of Dual-Port Meta-Surface MIMO Antenna With Pin Vias for IoT Technology
| dc.contributor.author | Supreeyatitikul, Nathapat | |
| dc.contributor.author | Boonpoonga, Akkarat | |
| dc.contributor.author | Phongcharoenpanich, Chuwong | |
| dc.contributor.author | Lerttheerachanchai, Wirote | |
| dc.contributor.author | Konpang, Jessada | |
| dc.date.accessioned | 2026-08-06T10:49:21Z | |
| dc.date.available | 2026-08-06T10:49:21Z | |
| dc.date.issued | 2025-01-01 | |
| dc.description.abstract | This study proposed a single-layer, compact, dual-port meta-surface multiple-input multiple-output (MIMO) antenna for Internet of Things (IoT) applications. Coupling between ports is effectively minimized using pin vias, which connects the meta-surface to the ground plane and functions as an LC resonator circuit to suppress useless frequencies. Here, L and C represent inductance and capacitance, respectively. Additionally, pin vias reduces mutual coupling by mitigating concentrated current distributions on the meta-surface components, achieving high isolation. The simulated results reveal a return loss bandwidth (RLBW) spanning 3.76-7.4 GHz (70% at a center frequency of 5.2 GHz) with isolation (S<inf>12</inf>) exceeding 19 dB. Furthermore, the envelope correlation coefficient is below 0.035, and the diversity gain reaches 9.82 dB. The antenna achieves a maximum gain of 5.54 dBi at 4.3 GHz. This demonstrates that the pin vias decoupling technique is highly effective for coupling reduction in meta-surface MIMO antennas. | |
| dc.identifier.citation | 22nd International Conference on Electrical Engineering Electronics Computer Telecommunications and Information Technology Ecti Con 2025, 2025 | |
| dc.identifier.doi | 10.1109/ECTI-CON64996.2025.11100522 | |
| dc.identifier.other | 2-s2.0-105014351601 | |
| dc.identifier.uri | https://dspace.kmitl.ac.th/handle/123456789/16497 | |
| dc.source | 22nd International Conference on Electrical Engineering Electronics Computer Telecommunications and Information Technology Ecti Con 2025 | |
| dc.subject | Diversity gain | |
| dc.subject | envelope correlation coefficient | |
| dc.subject | IoT | |
| dc.subject | meta-surface | |
| dc.subject | MIMO | |
| dc.title | Coupling Minimization of Dual-Port Meta-Surface MIMO Antenna With Pin Vias for IoT Technology | |
| dc.type | Conference Paper |
