Effect of soldering condition on formation of intermetallic phases developed between Sn-0.3Ag-0.7Cu low-silver lead-free solder and Cu substrate

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dc.contributor.authorMookam, Niwat
dc.contributor.authorKanlayasiri, Kannachai
dc.date.accessioned2026-08-06T10:02:20Z
dc.date.available2026-08-06T10:02:20Z
dc.date.issued2011-05-26
dc.description.abstractIn this paper, effect of soldering time and temperature on formation of intermetallic compounds developed between Sn-0.3Ag-0.7Cu lead-free solder and copper substrate was investigated. Dip soldering was performed at 250, 270, and 290 °C with soldering time of 5, 10, 15, and 20 s. Either ε-Cu <inf>3</inf>Sn or η-Cu<inf>6</inf>Sn<inf>5</inf> intermetallic phase was found at the interface between the solder and the substrate depending on the soldering condition, i.e., soldering time and soldering temperature. ε-Cu<inf>3</inf>Sn was found only when the substrate was soldered at 250 °C for 5 and 10 s. At other soldering conditions, only η-Cu <inf>6</inf>Sn<inf>5</inf> was found at the interfacial zone. Crystal structure of ε-Cu<inf>3</inf>Sn intermetallic phase was orthorhombic, and it was hexagonal structure for η-Cu<inf>6</inf>Sn<inf>5</inf>. Transformation of the intermetallic phases was also discussed. © 2011 Elsevier B.V. All rights reserved.
dc.identifier.citationJournal of Alloys and Compounds, 509(21), 6276-6279, 2011
dc.identifier.doi10.1016/j.jallcom.2011.03.049
dc.identifier.issn09258388
dc.identifier.other2-s2.0-79955598843
dc.identifier.urihttps://dspace.kmitl.ac.th/handle/123456789/3642
dc.sourceJournal of Alloys and Compounds
dc.subjectIntermetallics
dc.subjectMechanical properties
dc.subjectMetals and alloys
dc.subjectMicrostructure
dc.titleEffect of soldering condition on formation of intermetallic phases developed between Sn-0.3Ag-0.7Cu low-silver lead-free solder and Cu substrate
dc.typeArticle

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